Investigation of the Effect of Micro Beam Length Variation on Deformation

Abstract

In this study, the design and deformation analysis of the micro beam, which forms the basis of many micro-electro-mechanical-systems (MEMS), was carried out. The current passing through the micro beam distributes the heat energy by thermal expansion. This expansion varies depending on the current passing through the beam and the radiating temperature. For the model designed using COMSOL software, polycrystalline silicon material was assigned and necessary analyzes were performed. This material is a type of material that is frequently used in the field of MEMS due to its important physical and electrical properties. The support points on both ends of the modeled microbeam are firmly connected to a substrate. By applying 10V input potential to the model from these support points, deformation and temperature data emerging in the micro beam were examined. In experimental studies, deformations that occur by changing the length of the micro-beam assigned polycrystalline material have been reported. While a significant increase is observed between the deformation data that occurs in the models created by entering four different beam lengths (50 µm, 100 µm, 150 µm and 200 µm); temperature values are close to each other. The highest deformation for the polycrystalline silicon material was 2.01 µm in the 200 µm long micro beam; the lowest deformation was measured as 50 µm and 0.6 µm in length. Deformation values for micro beam lengths of 100 µm and 150 µm were measured as 0.93 µm and 1.41 µm, respectively. Temperature data was the lowest at 4890 K; measured as the highest 4940K. As a result, it has been observed that the change of beam length seriously affects the deformation properties of the micro beam design.

Keywords

• Micro beam
• Electrical potential
• COMSOL

Mikro Kiriş Uzunluğu Değişiminin Deformasyona Etkisinin Araştırılması

Abstract

Bu çalışmada birçok mikro-elektro-mekanik- sistemin (MEMS) temelini oluşturan mikro kirişin tasarımı ve analizi gerçekleştirilmiştir. Mikro kiriş içerisinden geçen akım, termal genleşme ile ısı enerjisini dağıtmaktadır. Bu genleşme, kiriş içerisinden geçen akım ve yayılan sıcaklığa bağlı olarak değişmektedir. COMSOL yazılımı kullanılarak tasarlanan model için polikristalin silikon malzeme ataması gerçekleştirilerek gerekli analizler yapılmıştır. Bu malzeme, önemli fiziksel ve elektriksel özellikleri nedeniyle MEMS alanında çok sık kullanılan bir malzeme türüdür. Oluşturulan mikro kirişin iki ucundaki destek noktaları bir substrata sıkıca bağlanır. Bu destek noktalarından modele 10V giriş potansiyeli uygulanarak mikro kirişte üretilen yer değiştirmeler ve sıcaklık verileri incelenmiştir. Sabit gerilim altında polikristalin malzeme için mikro kiriş uzunlukları değiştirilerek ortaya çıkan deformasyonlar rapor edilmiştir. Dört farklı kiriş uzunluğu (50 µm, 100 µm, 150 µm ve 200 µm) girilerek oluşturulan modellerde ortaya çıkan deformasyon verileri arasında ciddi bir artış gözlemlenirken sıcaklık değerleri birbirine yakın çıkmıştır. Polikristalin silikon malzeme için en yüksek deformasyon 200 µm uzunluğundaki mikro kirişte 2.01 µm iken; en düşük deformasyon 50 µm uzunluğunda 0.6 µm olarak ölçülmüştür. Sıcaklık verileri ise en düşük 4890 K iken; en yüksek 4940 K olarak ölçülmüştür. Sonuç olarak, mikro kiriş tasarımında kiriş uzunluğu değişiminin deformasyon özelliklerini ciddi bir biçimde etkilediği gözlemlenmiştir.

Keywords

• Mikro kiriş
• Elektrik potansiyeli
• COMSOL

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