Effect of Process Parameters on Surface Quality for Wire Saw Cutting of Alumina Ceramic

Abstract

Silicon wafers are sliced using wire saw in micro electronics and photo voltaic industries. Wire saw process occupies a great portion of silicon wafer production cost which affects the market directly. The process is also used to cut ceramics, concrete and rocks in civil engineering. The high cost of the process motivates researchers to develop models that will relate the process efficiency and quality with process parameters. In this study, an experimental parametric study was conducted to investigate the effect of process parameters on the wire bow angle, distributed wire load and surface roughness in wire saw cutting of alumina ceramic. The material removal and surface damage formation mechanisms are identified. Process design recommendations for increasing efficiency of the process while keeping the surface roughness constant, are presented. The surface roughness increases with increasing feed rate, decreases with wire speed and is independent of wire tension. The material is removed by trans-granular failure of the grains while inter-granular fractures of the grains affect the surface quality.

Key Words: wire saw, ductile regime machining, surface

roughness, ceramic.

 

 

 

Keywords

• wire saw, ductile regime machining, surface roughness, ceramic.

References

1. Hu, L., Kao, I., “Galerkin Based modal analysis on the vibration of wire-slurry system in wafer slicing using a wiresaw”, Journal of Sound and Vibration, 283: 589-620 (2005).
2. Clark, W.I., Shih, A.J., Hardin, C.W., Lemaster, R.L., McSpadden, S.B., “Fixed abrasive diamond wire machining – Part II: experiment design and results”, International Journal of Machine Tools and Manufacture, 43: 533-542(2003).
3. Ge, P.Q., Zhang, L., Gao, W., Liu, Z.C., “Development of endless diamond wiresaw and sawing experiments”, Materials Science Forum, 471-472, 481-484(2004).
4. Moller, J.H., “Basic mechanisms and models of multi–wire sawing”, Advanced Engineering Materials, 6-7, 501-513(2004).
5. Bhagavat, M., Prasad, V., Kao, I., “Elastohydrodynamic interaction in the free abrasive wafer slicing using a wiresaw: modeling and finite element analysis”, Transactions of ASME, Tribology Division April, 122: 394-404(2000).
6. Liu, B.C., Zhang, Z.P., Sun, Y.H., “Sawing trajectory and mechanism of diamond wire saw”, Key Engineering Materials, 259-260, 395-400(2004).
7. Wei, S., Kao, I., “Analysis of stiffness control and vibration of wire in wiresaw manufacturing process”, Proceeding of ASME, Manufacturing Science and Engineering Division, 813-818(1998).
8. Wei, S., Kao, I., “Vibration analysis of wire and frequency response in the modern wire saw manufacturing process”, Journal of Sound and Vibration, 231(5):1383-1395(2000).

9. Clark, W.I., Shih, A.J., Hardin, C.W., Lemaster, R.L., McSpadden, S.B., “Fixed abrasive diamond wire machining – Part I: process monitoring and wire tension force”, International Journal of Machine Tools and Manufacture, 43: 523-532(2003).
10. Hardin, C.W., Qu, J., Shih, A.J., “Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers”, Materials and Manufacturing Processes, 19(2): 355-367(2004).
11. Meng, J.F., Li, J.F., Ge, P.Q., Zhou, R., “Research on endless wire saw cutting of Al2O3/TiC Ceramics”, Key Engineering Materials, 315-316, 571-574(2006).
12. Bhagavat, S., Kao, I., “Theoretical analysis on the effects of crystal anisotropy on wiresawing process and application to wafer slicing”, Machine Tool and Manufacture, 46:531-541(2006).
13. Material Property Data, http://www.matweb.com/index.aspx, (accessed March 2008).
14. Cook, R.F., Pharr, G.M., “Direct observation and analysis of indentation cracking in glasses and ceramics”, Journal of American Ceramic Society, 73(4): 787-817(1990).
15. Pei-Lum, T., Bo-Huei, Y., Hsing, L.C., “Study on thin diamond wire slicing with Taguchi method”, Materials Science Forum, 505-507, 1219-1224(2006).
16. Yoshioka, J., Hashimoto, F., Miyashita, M., Kanai, A., Abo, T., Daito, M., “Ultraprecision grinding technology for brittle materials: application to surface and centerless grinding processes”, Milton C. Shaw Grinding Symposium, R. Komanduri, D. Maas, eds. ASME Production Engineering Division, 16: 209-227(1985).
17. Bifano, T.G.; Dow, T.A.; Scattergood, R.O., “Ductile-regime grinding: a new technology for machining brittle materials”, Journal of Engineering for Industry, 113: 184-189(1991).