Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning

Year 2026, Volume: 13 Issue: 1 , 391 - 403 , 31.03.2026

Ahmet Murat Yağci , Selim Acar

https://doi.org/10.54287/gujsa.1866197

https://izlik.org/JA35XH53RL

Abstract

This article reports on the optimization of Au wire bonding for GaAs chips. The effects of bonding parameters on ball size were evaluated by measuring both the average diameter and its standard deviation. Using the parameter set with the smallest deviation, argon plasma cleaning was applied to the pads while maintaining the unchanged bonding conditions. Although the average pull strength remained nearly constant, the standard deviation decreased from 1.1 to 0.61, indicating an improvement in process consistency. These results demonstrate that plasma-assisted surface treatment provides a more consistent and reliable wire bonding process in GaAs packaging applications.

Keywords

Wire Bonding , Plasma Treatment , Wire Pull Strength , Chip Packaging

References

• Alim, M. A., Abdullah, M. Z., Aziz, M. S. A., & Kamarudin, R. (2021). Die attachment, wire bonding, and encapsulation process in LED packaging: A review. Sensors and Actuators, A: Physical, 329, 112817. https://doi.org/10.1016/j.sna.2021.112817
• Amri, M. S., Rashid, W. N. A., Harun, F., Kadmin, A. F., Basar, M. F., & Rahman, K. A. A. (2020). An Improvement of Plasma Cleaning Time towards Leadframe Oxidation Performance. Journal of Physics: Conference Series, 1529(4), 042024. https://doi.org/10.1088/1742-6596/1529/4/042024
• An, B., Zhou, H., Cao, J., Ming, P., Persic, J., Yao, J., & Chang, A. (2023). A Review of Silver Wire Bonding Techniques. Micromachines, 14(11), 2129. https://doi.org/10.3390/mi14112129
• Chan, Y. H., Kim, J. K., Liu, D., Liu, P. C. K., Cheung, Y., & Ng, M. W. (2005). Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding. IEEE Transactions on Advanced Packaging, 28, 674–684. https://doi.org/10.1109/TADVP.2005.853548
• Czerny, B., & Khatibi, G. (2022). Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics. Journal of Microelectronics and Electronic Packaging, 19(2), 49–55. https://doi.org/10.4071/imaps.1717134
• Fan, J., Zhu, L., Yang, F., Cao, J., Zhang, J., & Wang, F. (2025). Study of free-air-ball and bonding properties of Ag-Au-Pd alloy wires. Journal of Micromechanics and Microengineering, 35, 055004. https://doi.org/10.1088/1361-6439/adcc3f
• Gan, C. L., & Hashim, U. (2015). Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years. Journal of Materials Science: Materials in Electronics., 26, 4412–4424. https://doi.org/10.1007/s10854-015-2892-8
• Gomes, J., Mayer, M., & Lin, B. (2015). Development of a fast method for optimization of Au ball bond process. Microelectronics Reliability, 55, 602–607. https://doi.org/10.1016/j.microrel.2014.12.013
• Khajehvand, M., Seppänen, H., & Sepehrband, P. (2024). Bond-pad damage in ultrasonic wedge bonding. Microelectronics Reliability, 152, 115279. https://doi.org/10.1016/j.microrel.2023.115279
• Knotter, D. M., Rink, I. A., Claassen, W. A. P., & Philipsen, J. H. M. (2011). Bond pad surface quality for reliable wire bonding. Microelectronic Engineering, 88, 3452–3458. https://doi.org/10.1016/j.mee.2011.01.075
• Li, F. (2022). 3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 12(10), 1601–1608. https://doi.org/10.1109/TCPMT.2022.3210477
• Long, Y., Twiefel, J., & Wallaschek, J. (2017). A review on the mechanisms of ultrasonic wedge-wedge bonding. Journal of Materials Processing Technology, 245, 241–258. https://doi.org/10.1016/j.jmatprotec.2017.02.012
• Mostafavi, S., Hesser, D. F., & Markert, B. (2018). Effect of process parameters on the interface temperature in ultrasonic aluminum wire bonding. Journal of Manufacturing Processes, 36, 104–114. https://doi.org/10.1016/j.jmapro.2018.09.020
• Papadopoulos, C., Villiger, T., Steiner, S., Prinz, J., Morabito, C., Cammarata, M., Rodriguez, A., Kwon, J., Geilenkeuser, R., Breuer, D., Kuechenmeister, F., Dienelt, J., Urban, J., Kabus, H., & Krinke, J. (2020). Gold wire bond study for automotive application. Microelectronics Reliability, 114, 113899. https://doi.org/10.1016/j.microrel.2020.113899
• Peng, H. Y., Devarajan, M., Lee, T. T., & Lacey, D. (2015). Comparison of radio frequency and microwave plasma treatments on LED chip bond pad for wire bond application. IEEE Transactions on Components, Packaging and Manufacturing Technology, 5, 562–569. https://doi.org/10.1109/TCPMT.2015.2406876
• Sammut, S. (2025). A Comprehensive Review of Plasma Cleaning Processes Used in Semiconductor Packaging. Applied Sciences, 15(13), 7361. https://doi.org/10.3390/app15137361
• Xu, H., Liu, C., Silberschmidt, V. V., Chen, Z., & Wei, J. (2010). Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads. Journal of Materials Processing Technology, 210, 1035–1042. https://doi.org/10.1016/j.jmatprotec.2010.02.012
• Zhou, H., Chang, A., Fan, J., Cao, J., Zhang, Y., An, B., & Xia, J. (2023a). Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy Wire. Micromachines, 14(8), 1587. https://doi.org/10.3390/mi14081587
• Zhou, H., Zhang, Y., Cao, J., Su, C., Li, C., Chang, A., & An, B. (2023b). Research Progress on Bonding Wire for Microelectronic Packaging. Micromachines, 14(2), 432. https://doi.org/10.3390/mi14020432