Thermal performance investigation of position function circuit board used in automotive exterior rear lighting

Year 2022, Volume: 11 Issue: 2, 83 - 90, 01.07.2022

Birhat Sönmezay , Mehmet Aktaş

https://doi.org/10.18245/ijaet.830838

Abstract

In this research, both numerically and experimentally, the thermal efficiency of a Printed Circuit Board (PCB) with two Light Emitting Diode (LED) chips was examined. The two LED lighting systems, which are single-cell LEDs, including PCB and copper plates, were manufactured, and tested under laboratory conditions to achieve this goal. The three-dimensional Computational Fluid Dynamics (CFD) model with natural convection effects prepared using the FloEFD software package to predict PCB surface temperature distributions. The goal was to perform comprehensive circuit board simulation and validate the numerical model built in this study using the experimental data during the studies. From the results, we can easily claim that higher temperature gradients are calculated and predicted near the LED chip because of heat generation. Data paths have played an essential role in the LED circuit board's temperature distribution. High-temperature variations are observed at short distances around the LED when the experimental and simulation results are compared. Temperature changes are minimized as they travel away from the LED chip. It is found that the error rate is below 5 percent overall between the experimental and simulation results. The numerical results were in proper alignment with numerical data obtained from the three-dimensional (3D) CFD model. Given thermal efficiency and using such models, this model can design and analyze Automotive Lighting Systems.

Keywords

Automotive lighting, CFD, LED, Heat transfer, Printed circuit board (PCB)

References

• Choi, S., Kim, Y., Byun S., Choi K. A Study on Predictable Program of LED Junction Temperature in Natural Convection. 9th International Symposium on Automotive Lighting, 27-28 September 2011, Darmstadt, Germany.
• Tsai, M., Chen, C., Kang, C. (2012) “Thermal measurements and analyses of low-cost high-power LED packages and their modules”, Microelectronics Reliability, 52: 845 – 854
• Kikuchi, K. Thermal simulation of LED unit for Headlamp and Rear lamp. 9th International Symposium on Automotive Lighting, 27-28 September 2011, Darmstadt, Germany.
• Yung, K., Liem, H., Choy, H., Lun W., (2010) Thermal performance of high brightness LED array package on PCB. International Communications in Heat and Mass Transfer, 37: 1266 – 1272
• Mornet E., (2009). Thermal management of LED for signaling and lighting functions. 8th International Symposium on Automotive Lighting, 28-30 September, Darmstadt, Almanya
• Christensen A., Graham S., (2009). Thermal effects in packaging high power light emitting diode arrays Applied Thermal Engineering 29 pp.364–371
• Keppens A., Chen h., Lu Y., Chen Z., Gao Y., Deconinck G., Hanselaer P. (2011) “Light-emitting diode junction temperature and power Determination from forward current”. Light & Engineering, 19(1): 34-44.
• Kwok K.F., Divakar B.P., Cheng K.W.E., Design of an LED Thermal System for Automotive Systems 3rd International Conference on Power Electronics Systems and Applications, Hong Kong, China 20-22 May 2009
• Cheng T., Luo X., Huang S., Liu S. (2010) “Thermal analysis and optimization of multiple LED packaging based on a general analytical solution”. International Journal of Thermal sciences, 49: 196 – 201.
• Saati K. F., Tufekci, C.S., Arik M. A Computational and Experimental Study on a Harsh Environment LED System for Vehicle Exterior Lighting Applications. 4th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 27-30 May 2014, Orlando, FL, USA