Research Article

Stresses Occurring on a Cylinder with Annular Silicon Carbide (SiC), Ti6Al4V and Copper (Cu) materials

Volume: 02 July 31, 2024
EN

Stresses Occurring on a Cylinder with Annular Silicon Carbide (SiC), Ti6Al4V and Copper (Cu) materials

Abstract

In this study, the stresses occurring in the annular cylinder modeled as a circular layer were analyzed numerically. Of the materials selected in accordance with the cylinder; Silicon Carbide (SiC) is known to be frequently used in the avia-tion industry due to the high abrasion and erosion resistance of the material. In this study, Silicon Carbide (SiC) is lo-cated in the upper layer of the annular cylinder due to its high strength. Titanium alloy and Ti6Al4V materials are also used in the aircraft and defense industry, where high strength, low weight and resistance to high temperatures are of great importance. Copper (Fr) material also shows high corrosion resistance. At the end of the study, it was seen that Silicon Carbide (SiC) with high elastic modulus has higher resistance to heat than Ti6Al4V (Titanium alloy) material. It has been observed that the stresses occurring in the Ti6Al4V (Titanium alloy) material part are higher than in the Cop-per (Cu) material Fractions. The results obtained at the end of the study were shared with graphs. In addition to the results obtained, the stresses obtained in a regional part of the disk with the ANSYS 2024 program were shown with graphs.

Keywords

Supporting Institution

_

Project Number

.-

Ethical Statement

_

Thanks

Dergimize çok teşekkür ediyorum

References

  1. 1. Özkan, M. Y., & Uğurlu, B. (2016). The effect of temperature and velocity on stress distribution in rotating disks. Journal of Mechanical Engineering, 45(3), 215-225.
  2. 2. Eraslan, A. N., & Arslan, E. (2010). Thermoelastic stress analysis in rotating annular disks. Interna-tional Journal of Mechanical Sciences, 52(10), 1353-1361.
  3. 3. Singh, T., & Verma, R. S. (2018). Stress distribution in rotating composite disks. Composite Structures, 195, 87-95.
  4. 4. Zhao, Y., & Liew, K. M. (2012). Finite element analysis of rotating functionally graded material disks. Computational Mechanics, 50(2), 193-203.
  5. 5. Lekhnitskii, S. G. (1981). Theory of Elasticity of an Anisotropic Elastic Body. Mir Publishers.
  6. 6. Carrier, G. F., & Pearson, C. E. (1953). Partial Differential Equations: Theory and Technique. Academic Press. 7. Srinivas V B, Manthena V R, Warbhe S D, Kedar G D, Lamba NK. Thermal stresses associated with a thermosensitive multilayered disc analysed due to point heating. International Journal of Applied Mechanics and Engineering. 2024;29(2):118-137. doi:10.59441/ijame/187051.)
  7. 8. Manthena V.R. Srinivas V.B. Kedar G.D. (2020). Analytical solution of heat conduction of a multi-layered annular disk and associated thermal de-flection and thermal stresses, Journal of Thermal Stresses 43(5): 563-578.
  8. 9. Hosseini M. Arani A.G. Karamizadeh M. Niknejad S.H., Hosseinpour A. (2022). Static and dynamic stability analysis of thick CNT reinforced beams resting on pasternak foundation under axial and follower forces, Journal of Solid Mechanics 14(1): 1-16.

Details

Primary Language

English

Subjects

Solid Mechanics

Journal Section

Research Article

Publication Date

July 31, 2024

Submission Date

June 17, 2024

Acceptance Date

July 22, 2024

Published in Issue

Year 2024 Volume: 02

APA
Kayıran, H. F. (2024). Stresses Occurring on a Cylinder with Annular Silicon Carbide (SiC), Ti6Al4V and Copper (Cu) materials. Journal of Engineering and Basic Sciences, 02, 35-40. https://izlik.org/JA78MX75JG
AMA
1.Kayıran HF. Stresses Occurring on a Cylinder with Annular Silicon Carbide (SiC), Ti6Al4V and Copper (Cu) materials. JOEBS. 2024;02:35-40. https://izlik.org/JA78MX75JG
Chicago
Kayıran, Hüseyin Fırat. 2024. “Stresses Occurring on a Cylinder With Annular Silicon Carbide (SiC), Ti6Al4V and Copper (Cu) Materials”. Journal of Engineering and Basic Sciences 02 (July): 35-40. https://izlik.org/JA78MX75JG.
EndNote
Kayıran HF (July 1, 2024) Stresses Occurring on a Cylinder with Annular Silicon Carbide (SiC), Ti6Al4V and Copper (Cu) materials. Journal of Engineering and Basic Sciences 02 35–40.
IEEE
[1]H. F. Kayıran, “Stresses Occurring on a Cylinder with Annular Silicon Carbide (SiC), Ti6Al4V and Copper (Cu) materials”, JOEBS, vol. 02, pp. 35–40, July 2024, [Online]. Available: https://izlik.org/JA78MX75JG
ISNAD
Kayıran, Hüseyin Fırat. “Stresses Occurring on a Cylinder With Annular Silicon Carbide (SiC), Ti6Al4V and Copper (Cu) Materials”. Journal of Engineering and Basic Sciences 02 (July 1, 2024): 35-40. https://izlik.org/JA78MX75JG.
JAMA
1.Kayıran HF. Stresses Occurring on a Cylinder with Annular Silicon Carbide (SiC), Ti6Al4V and Copper (Cu) materials. JOEBS. 2024;02:35–40.
MLA
Kayıran, Hüseyin Fırat. “Stresses Occurring on a Cylinder With Annular Silicon Carbide (SiC), Ti6Al4V and Copper (Cu) Materials”. Journal of Engineering and Basic Sciences, vol. 02, July 2024, pp. 35-40, https://izlik.org/JA78MX75JG.
Vancouver
1.Hüseyin Fırat Kayıran. Stresses Occurring on a Cylinder with Annular Silicon Carbide (SiC), Ti6Al4V and Copper (Cu) materials. JOEBS [Internet]. 2024 Jul. 1;02:35-40. Available from: https://izlik.org/JA78MX75JG

     download?token=eyJhdXRoX3JvbGVzIjpbXSwiZW5kcG9pbnQiOiJmaWxlIiwicGF0aCI6IjY0YjkvZGMxZC80MzY5LzY4Njc5ODZkMjZmMzEucG5nIiwiZXhwIjoxNzU5MDQ4OTc4LCJub25jZSI6IjRiNjgxM2VkMjdlOGRlYzdjN2ZjM2E1OWYwMDMzOGM2In0.muS64PI-pzVj3uw574Iq70DPGP35CC848_IRD2XGN8Q            download?token=eyJhdXRoX3JvbGVzIjpbXSwiZW5kcG9pbnQiOiJmaWxlIiwicGF0aCI6ImJiMzYvZmU4NS9jMDMyLzY4OWM5MTkxYjk3ZTcucG5nIiwiZXhwIjoxNzU5MDQ5MDkxLCJub25jZSI6ImIxMjllNWRlMWNhNjYwNjBmMmEwZTk5ODNkY2I0MzkwIn0.DxiKu0Zpn-vPFgUBGsuiCr39WTnZPy8JTQbJWrG4Xs0             download?token=eyJhdXRoX3JvbGVzIjpbXSwiZW5kcG9pbnQiOiJmaWxlIiwicGF0aCI6ImQ2NjAvMjFjYS9kNTJkLzY4OWM4YWRmODhiMzcucG5nIiwiZXhwIjoxNzU5MDQ5Mjg5LCJub25jZSI6Ijk5NDNlOTRiN2NkY2ZlNDdjY2ViYjdmMjYwOWFhMmU4In0.FdEZrYIbOOKE9ViBoDcEp2PUU5HWJc6EgaKe2KfZqU0

Flag Counter

(CC BY-NC-SA 4.0). Deed | Attribution-NonCommercial-ShareAlike 4.0 International | Creative Commons