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Mikro Elektro Mekanik Sistemler, Genel Bir Tanıtım

Year 2002, Volume: 4 Issue: 3, 173 - 185, 01.05.2002

Abstract

Bu
makale yeni bir araştırma dalı olan mikro-elektro-mekanik sistem
teknolojilerini tanıtmayı hedeflemektedir. Makalede, yüzey/gövde mikro-işleme, elektro-erozyon,
lazerle işleme ve yüksek derinlik oranlarına sahip mikro yapıların üretiminde
kullanılan LIGA teknikleri gibi başlıca mikro-üretim yöntemleri kısaca ele
alınıp, karşılaştırmalı olarak tanıtılacaktır. Bu üretim teknikleriyle yapılmış
silisyum tabanlı mikro-duyucu ("micro-sensors") ve mikro eyleyicilere
("micro-actuators") çeşitli örnekler verilecektir. Bu makalede ayrıca
mikro-mekanik sistemlerin (dizgelerin) tasarlanmasında kullanılan ölçeklendirme
kanunları ele alınacaktır.

References

  • [1] Analog Devices, "ADXL150/ADXL250 rev.0" Ürün kataloğu, Norwood, MA, 1996.
  • [2] Lorenz, R. D., "Sensorless Control: High Bandwidth Tracking of Spatial Saliencies using Persistent Excitation," WEMPEC/CAST Seminar Notes, University of Wisconsin Madison, 1999.
  • [3] Feynman, R. P., `There's Plenty of Room at the Bottom," presented at the American Physical Society Meeting in Pasadena CA, Dec. 26, 1959; (tekrar basım) Journal of Microelectromechanical Systeıns, yol. 1:1, 60- 66. Mart 1992
  • [4] Howe, R. T., "Surface Micromachining for Microsensors and Microactuators," Journal of Vac. Sci. Technology, B., 6„ 1809-1813, Aralık 1988.
  • [5] Menz, W., Bacher, W., Harmening, M., and Michel, A., "The LIGA Technique - a Novel Concept for Microstruetures and the Combination with Si-Technologies by Injection Molding," IEEE Proceedings of Micro Electro Mechanical Systems, Nara, Japan, 69-73, 199 İ.
  • [6] Foong, C. S., Wood, K. L., and Busch-Vishniac, I., "Design Assessment of Micro-Electro-mechanical Systems with Applications to a Microbiology Cell Injector," Micromechanical Systems, ASME DSC, yol. 46, 49-63, 1993.
  • [7] Kovacs, G. T. A., Maluf, N. I., and Petersen, K. E., "Bulk Machining of Silicon, " Proc. of the IEEE, yol. 86:8, 1536-1551, Ağustos 1998.
  • [8] Sze, M., Semiconductor Sensors, John Wiley & Sons Inc., NY, 1994.
  • [9] Akın, T., Najafi, K., Smoke, R, and Bradley, R. M., "A Micromachined Silicon Sieve Electrode for Nerve Regeneration Applications," IEEE Trans. on Biomedical Engineering, vol. BME-41, No. 4, 305-313, Nisan 1994.
  • [10] Shimbo, 1. M., Furukawa, K., Fukuda, K., and Tanzawa, K., "Silicon-to-Silicon Direct Bonding Method," J. Applied Physics, yol. 60, 2987-2989, 1986.
  • [11] Mack, S., Baumann, H., and Gosele, U., "Gas Tightness of Cavities Sealed by Silicon Wafer Bonding," IEEE Proceedings of Micro Electro Mechanical System, Nogoya, Japan, 488-493, Jan. 1997. [12] Schomburg, W. K., Maas, D., Bustgens, B., and Fahrenberg, J., Menz, W., and Seidel, D., "Assembly for Micromechanics and LIGA," J. of Micromechanics and Microengineering, vol.5, 57-63, 1995.
  • [13] Shoji, S., Kikuchi, H., and Torigoe, H., "Anodic Bonding Below 180'C for Packaging and Assembling of MEMS Using Lithium Alminosilicate- ,8 -Quartz Glass-Ceramic," IEEE Proceedings of Micro Electro Mechanical Systems, Nogoya, Japan, 482-487, Ocak 1997.
  • [14] Ando, D., Oishi, K., Nakamura, T., Umeda, S., "Glass Direct Bonding Technology for Hermetic Seal Package," IEEE Proceedings of Micro Electro Mechanical Systems, Nogoya, Japan, 186-190, Ocak 1997.
  • [15] Quenzer, H. J., Dell, C., and Wagner, B., "Silicon-Silicon Anodic-Bonding with Intermediate Glass Layers Using Spin-On Glasses," IEEE Proceedings of Micro Electro Mechanical Systems, San Diego, California, sf. 272, Şubat 1996.
  • [16] Maas, D., Bustgens, B., Fahrenberg, J., Keller, W., Ruther, P., Schomburg, W. K., and Seidel, D., "Fabrication of Microcomponents Using Adhesive Bonding Techniques," IEEE Proceedings of Micro Electro Mechanical Systems, San Diego, California, 331-336, Şubat
  • [17] Field, L. A., and Muller, R. S., "Fusing Silicon Wafers With Low Melting Temperature Glass," Sensors and Actuators, A21-A23, 935-938, 1990.
  • [18] Tong, Q. Y., Cha, G., Gafiteanu, R., and Gosele, V., "Low Temperature Wafer Direct Bonding," J. Microelectromechanical Systems, vol. 3:1, 29- 35, Mart 1994.
  • [19] Guckel, H, et al. "Deep X-Ray Lithographies for Micromechanics," Technical Digest of the 1990 Solid State Sensor and Actuator Workshop, Hilton Head Island, SC, 118-122, Haziran 1990.
  • [20] Guckel, H., "Micromechanics for Microactuators and Precision Engineering," Precision Engineering (Seminer Notları), University of Wisconsin — Madison, Haziran 1997.
  • [21] Kinoshita, H., Veda, K. Murai, S., and Hayashi, K., "Micro-wire Electrical Discharge Machining," Proc. of the 1st IIFTOMM International Micro mechanism Symposium, Tokyo Inst. of Tech. 114-119, Haziran 1993.
  • [22] Bloomstein, T. M. and Ehrlich, D. J., "Laser Deposition and Etching of Three-dimensional Microstructures," Proc. of Transducers '91, the 6th International Conference on Solid-State Sensors and Actuators Digest of Technical Papers. San Francisco, CA, IEEE Press, 507— 511, 1991.
  • [23] Westberg, H., Boman, M., Johansson S., Schweitz, J. A, "Truly Three Dimensional Structures Microfabricated by Laser Chemical Processing," Proc. of IEEE Transducers, 516- 519, 1991.
  • [24] Michalicek, M. A., "Introduction to Microelectromechanical Systems," online sunu (http://mems.colorado.edu/), University of Colorado, Boulder, Mayıs 2000.
  • [25] Gianchandani Y and Najafi, K., "A Bulk Silicon Dissolved Wafer Process for Microelectromechanical Systems," J. Microelectromechanical Systems, yol. 1:2, Haziran
Year 2002, Volume: 4 Issue: 3, 173 - 185, 01.05.2002

Abstract

References

  • [1] Analog Devices, "ADXL150/ADXL250 rev.0" Ürün kataloğu, Norwood, MA, 1996.
  • [2] Lorenz, R. D., "Sensorless Control: High Bandwidth Tracking of Spatial Saliencies using Persistent Excitation," WEMPEC/CAST Seminar Notes, University of Wisconsin Madison, 1999.
  • [3] Feynman, R. P., `There's Plenty of Room at the Bottom," presented at the American Physical Society Meeting in Pasadena CA, Dec. 26, 1959; (tekrar basım) Journal of Microelectromechanical Systeıns, yol. 1:1, 60- 66. Mart 1992
  • [4] Howe, R. T., "Surface Micromachining for Microsensors and Microactuators," Journal of Vac. Sci. Technology, B., 6„ 1809-1813, Aralık 1988.
  • [5] Menz, W., Bacher, W., Harmening, M., and Michel, A., "The LIGA Technique - a Novel Concept for Microstruetures and the Combination with Si-Technologies by Injection Molding," IEEE Proceedings of Micro Electro Mechanical Systems, Nara, Japan, 69-73, 199 İ.
  • [6] Foong, C. S., Wood, K. L., and Busch-Vishniac, I., "Design Assessment of Micro-Electro-mechanical Systems with Applications to a Microbiology Cell Injector," Micromechanical Systems, ASME DSC, yol. 46, 49-63, 1993.
  • [7] Kovacs, G. T. A., Maluf, N. I., and Petersen, K. E., "Bulk Machining of Silicon, " Proc. of the IEEE, yol. 86:8, 1536-1551, Ağustos 1998.
  • [8] Sze, M., Semiconductor Sensors, John Wiley & Sons Inc., NY, 1994.
  • [9] Akın, T., Najafi, K., Smoke, R, and Bradley, R. M., "A Micromachined Silicon Sieve Electrode for Nerve Regeneration Applications," IEEE Trans. on Biomedical Engineering, vol. BME-41, No. 4, 305-313, Nisan 1994.
  • [10] Shimbo, 1. M., Furukawa, K., Fukuda, K., and Tanzawa, K., "Silicon-to-Silicon Direct Bonding Method," J. Applied Physics, yol. 60, 2987-2989, 1986.
  • [11] Mack, S., Baumann, H., and Gosele, U., "Gas Tightness of Cavities Sealed by Silicon Wafer Bonding," IEEE Proceedings of Micro Electro Mechanical System, Nogoya, Japan, 488-493, Jan. 1997. [12] Schomburg, W. K., Maas, D., Bustgens, B., and Fahrenberg, J., Menz, W., and Seidel, D., "Assembly for Micromechanics and LIGA," J. of Micromechanics and Microengineering, vol.5, 57-63, 1995.
  • [13] Shoji, S., Kikuchi, H., and Torigoe, H., "Anodic Bonding Below 180'C for Packaging and Assembling of MEMS Using Lithium Alminosilicate- ,8 -Quartz Glass-Ceramic," IEEE Proceedings of Micro Electro Mechanical Systems, Nogoya, Japan, 482-487, Ocak 1997.
  • [14] Ando, D., Oishi, K., Nakamura, T., Umeda, S., "Glass Direct Bonding Technology for Hermetic Seal Package," IEEE Proceedings of Micro Electro Mechanical Systems, Nogoya, Japan, 186-190, Ocak 1997.
  • [15] Quenzer, H. J., Dell, C., and Wagner, B., "Silicon-Silicon Anodic-Bonding with Intermediate Glass Layers Using Spin-On Glasses," IEEE Proceedings of Micro Electro Mechanical Systems, San Diego, California, sf. 272, Şubat 1996.
  • [16] Maas, D., Bustgens, B., Fahrenberg, J., Keller, W., Ruther, P., Schomburg, W. K., and Seidel, D., "Fabrication of Microcomponents Using Adhesive Bonding Techniques," IEEE Proceedings of Micro Electro Mechanical Systems, San Diego, California, 331-336, Şubat
  • [17] Field, L. A., and Muller, R. S., "Fusing Silicon Wafers With Low Melting Temperature Glass," Sensors and Actuators, A21-A23, 935-938, 1990.
  • [18] Tong, Q. Y., Cha, G., Gafiteanu, R., and Gosele, V., "Low Temperature Wafer Direct Bonding," J. Microelectromechanical Systems, vol. 3:1, 29- 35, Mart 1994.
  • [19] Guckel, H, et al. "Deep X-Ray Lithographies for Micromechanics," Technical Digest of the 1990 Solid State Sensor and Actuator Workshop, Hilton Head Island, SC, 118-122, Haziran 1990.
  • [20] Guckel, H., "Micromechanics for Microactuators and Precision Engineering," Precision Engineering (Seminer Notları), University of Wisconsin — Madison, Haziran 1997.
  • [21] Kinoshita, H., Veda, K. Murai, S., and Hayashi, K., "Micro-wire Electrical Discharge Machining," Proc. of the 1st IIFTOMM International Micro mechanism Symposium, Tokyo Inst. of Tech. 114-119, Haziran 1993.
  • [22] Bloomstein, T. M. and Ehrlich, D. J., "Laser Deposition and Etching of Three-dimensional Microstructures," Proc. of Transducers '91, the 6th International Conference on Solid-State Sensors and Actuators Digest of Technical Papers. San Francisco, CA, IEEE Press, 507— 511, 1991.
  • [23] Westberg, H., Boman, M., Johansson S., Schweitz, J. A, "Truly Three Dimensional Structures Microfabricated by Laser Chemical Processing," Proc. of IEEE Transducers, 516- 519, 1991.
  • [24] Michalicek, M. A., "Introduction to Microelectromechanical Systems," online sunu (http://mems.colorado.edu/), University of Colorado, Boulder, Mayıs 2000.
  • [25] Gianchandani Y and Najafi, K., "A Bulk Silicon Dissolved Wafer Process for Microelectromechanical Systems," J. Microelectromechanical Systems, yol. 1:2, Haziran
There are 24 citations in total.

Details

Primary Language Turkish
Journal Section Genel Değerlendirme
Authors

Melik Dölen This is me

Halit Kaplan This is me

Publication Date May 1, 2002
Submission Date April 22, 2002
Published in Issue Year 2002 Volume: 4 Issue: 3

Cite

Vancouver Dölen M, Kaplan H. Mikro Elektro Mekanik Sistemler, Genel Bir Tanıtım. MATİM. 2002;4(3):173-85.