An Investigation of Adhesion Performance Under Various Conditions Using Heat-Treated Wood
Abstract
In this study, the adhesion performance of oak (Quercus petrea Liebl.) And Scotch pine (Pinus Silvestris L.) wood samples that were heat treated and glued with 1K-PUR adhesive were kept under different conditions (A1-A4-A5) and moisture contents (20°C /% 35, 20°C /%65 ve 20°C /% 95), and then the adhesion performance was investigated.
Rough sized pieces of both types of wood were heat treated at 195°C for 2 hours. Test samples were prepared from untreated and heat treated blanks (DIN EN 204). Tensile tests according to DIN EN 204 were applied to samples kept at 20°C/35%, 20°C/65% and 20°C/95% temperature and relative humidity, respectively, and the adhesion performance was determined in three climatic conditions.
At the end of these tests, it was found that the holding environment and climatic conditions have a significant effect on the adhesion resistance. It was observed that the samples that were kept under A1 conditions and tested had wood rupture (error) between 70% and 100%, and the samples tested after holding in A4 and A5 conditions mostly broke off from the glue joint.
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References
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Details
Primary Language
English
Subjects
Engineering
Journal Section
Research Article
Authors
Mustafa Altunok
*
0000-0002-8441-8636
Türkiye
Publication Date
June 1, 2021
Submission Date
July 2, 2020
Acceptance Date
September 25, 2020
Published in Issue
Year 2021 Volume: 24 Number: 2
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