Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate

Year 2018, Volume: 21 Issue: 3, 587 - 589, 01.09.2018

Ahmet Mustafa Erer

https://doi.org/10.2339/politeknik.399077

Cited By: 1

Abstract

In this study, effect of
melting temperatures of Sn-3Ag (SAC300), Sn-3Ag-0.5Cu (SAC305) and Sn-0.3Ag-0.7Cu (SAC0307) ternary
Pb-free solder alloys on wettability were investigated. The sessile drop
technique was used in order to evaluate the contact angles of Pb-free solder
alloys on Cu substrate at predetermined temperatures (250, 280 and 310



















). The melting
temperatures of alloys were examined by differential scanning calorimeter (DSC)
that SAC305 Pb-free alloy has lower than those of SAC300 and SAC0307 alloys.
The best wettability was found for SAC305 and this was followed by SAC300 and
SAC0307. The lowest value of contact angle for SAC305 was 41.90

 at 310

 on Cu substrate.

Keywords

Contact angle, melting temperature, wettability

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