The primary aim of this work is to examine the crucial variations of key
mechanical design performance properties and mechanical characterization of Bi2.1Sr2.0-xTixCa1.1Cu2.0Oy superconducting ceramic cuprate materials with the aid of Vickers
hardness measurements performed at the different applied indentation test loads
between the value of 0.245 N and 2.940 N. In this study, all the materials are
prepared within the molar ratios of 0≤x≤0.10 by using the ceramic method in the
atmospheric air conditions. The experimental measurement results obtained show
that the increment of the aliovalent Sr/Ti partial substitution level in the
Bi-2212 crystal structure regresses remarkably the key design mechanical
performances such as the mechanical strength, stability, stiffness, critical
stress, toughness, flexural strengths and mechanical durability. This is
attributed to the fact that the existence of Ti impurity in the Bi-2212 main
matrix leads to the enhancement in the problematic defects, stress raisers and
crack initiation sites based on the crack-producing omnipresent flaws.
Accordingly, the propagation of the problematic defects accelerates
considerably at relative lower indentation test loads applied, and the
problematic defects locate easily in their critical propagation speed. All in
all, the defects formed in the crystal matrix by the Ti inclusions are out of
control, and the Sr/Ti partial substituted Bi2.1Sr2.0-xTixCa1.1Cu2.0Oy superconducting compounds are much easier broken. Additionally, it is
noted that every material produced show the typical indentation size effect but
in the reduction trend with enhancing the Sr/Ti partial substitution level. The
load-dependent mechanical parameters such as Young’s modulus, yield strength,
fracture toughness, brittleness index and elastic stiffness coefficients are
also discussed in the text.
Bi2.1Sr2.0-xTixCa1.1Cu2.0Oy cuprate Mechanical performance Mechanical characterization Vickers hardness Indentation size effect
Primary Language | English |
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Subjects | Material Production Technologies |
Journal Section | Research Articles |
Authors | |
Publication Date | October 1, 2019 |
Submission Date | February 13, 2019 |
Acceptance Date | April 11, 2019 |
Published in Issue | Year 2019 Volume: 23 Issue: 5 |
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.