Investigation Of Dielectric Properties For SnO2-PVA/n-Si Schottky Barrier Diode
Abstract
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Ethical Statement
Thanks
References
- D. Korucu, A. Turut. Temperature dependence of Schottky diode characteristics prepared with photolithography technique. International Journal of Electronics. 2014; 101:1595-1606.
- Ç. Bilkan, A. Gümüş, Ş. Altındal. The source of negative capacitance and anomalous peak in the forward bias capacitance-voltage in Cr/p-Si Schottky barrier diodes (SBDs). Mater Sci Semicon Proc. 2015; 39: 484-491.
- N. F. Mott, E. A. Dawis, Electronic Processes in Non Crystalline Materials, Clarendon Press, Oxford 1971. 437
- A. Kaya, S. Alialy, S. Demirezen, M. Balbaşı, S. A. Yerişkin, A. Aytimur, The investigation of dielectric properties and ac conductivity of Au/GO-doped PrBaCoO nanoceramic/n-Si capacitors using impedance spectroscopy method. Ceramics International. 2016; 42: 3322-3329.
- M. Mümtaz, N. A. Khan. Dielectric properties of Cu0.5Tl0.5Ba2Ca3Cu4O12−δ bulk superconductor. Physica C: Superconductivity and its Applications. 2009; 469: 728-731.
- S. Demirezen. Frequency-and voltage-dependent dielectric properties and electrical conductivity of Au/PVA (Bi-doped)/n-Si Schottky barrier diodes at room temperature. Appl Phys A. 2013; 112: 827-833.
- J. S. Lee, K. H. Choi, H. D. Ghim, S. S. Kim, D. H. Chun, H. Y. Kim, W. S. Lyoo. Role of molecular weight of atactic poly(vinyl alcohol) (PVA) in the structure and properties of PVA nanofabric prepared by electrospinning. J. Appl. Pol. Science. 2004; 93: 1638-1646
- Ç. Bilkan, Y. Azizian-Kalandaragh, Ş. Altındal, R. Shokrani-Havigh. Frequency and voltage dependence dielectric properties, ac electrical conductivity and electric modulus profiles in Al/Co3O4-PVA/p-Si structures. Physica B: Condensed Matter. 2016; 500: 154-160.
Details
Primary Language
English
Subjects
Electronic and Magnetic Properties of Condensed Matter; Superconductivity
Journal Section
Research Article
Authors
Çiğdem Bilkan
*
0000-0002-3347-673X
Türkiye
Publication Date
October 1, 2024
Submission Date
December 29, 2023
Acceptance Date
March 1, 2024
Published in Issue
Year 2024 Number: 1