Hydrothermal investigation of a nanofluid flow in a compound microchannels

Sarab Salih Shekho; Ahmed Fouad Al Neama

doi:10.14744/thermal.0000933

Hydrothermal investigation of a nanofluid flow in a compound microchannels

Abstract

In this research, CFD modelling was employed to quantitatively investigate the influence of laminar forced convective heat transfer employing Al2O3/water and CuO/water nanofluids as working mediums, with a volume concentration (φ) of 4%, in three distinct compound micro-channel heat sinks (MCHSs). Each MCHS features a bottom circular cavity and a narrow slot (namely rectangular, trapezoidal, or semicircular reentrant) attached to the circular cavity's crest. Their cooling efficacy was compared to that of a traditional straight rectangular MCHS. Both nanoparticles had a diameter of 47nm, and the nanofluid's thermophysical properties were temperature-dependent. The fluid inlet temperature was maintained at 20°C, whereas the volumetric flow rate (Qin) ranged from 20 to 100ml/min. The results demonstrated that employing a hybrid heat transfer augmentation technique with CuO/water nanofluid at Qin=100ml/min increased the average Nusselt number (Nuavg) of the rectangular reentrant MCHS by 7.1% and decreased the total thermal resistance (Rth) of the semicircular reentrant MCHS by 16.8%, compared to using water in a traditional MCHS. However, this improvement in Nuavg was accompanied by a 45.8% increment in the total pressure drop (∆Pt) when the rectangular reentrant MCHS within CuO/water nanofluid was used instead of the traditional MCHS with pure water. This improved heat transfer is attributed to flow separation, fluid acceleration in the main flow, and intensified fluid mixing in the three newly proposed MCHSs.

Keywords

References

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Details

Primary Language

English

Subjects

Fluid Mechanics and Thermal Engineering (Other)

Journal Section

Research Article

Authors

Sarab Salih Shekho This is me
0009-0002-3527-9673
Iraq

Ahmed Fouad Al Neama ^* This is me
0000-0003-3740-7157
Iraq

Publication Date

March 24, 2025

Submission Date

February 10, 2024

Acceptance Date

May 13, 2024

Published in Issue

Year 2025 Volume: 11 Number: 2

DOI

https://doi.org/10.14744/thermal.0000933

IZ

https://izlik.org/JA75WW65JT

Cite

RIS / Bibtex

APA

Shekho, S. S., & Al Neama, A. F. (2025). Hydrothermal investigation of a nanofluid flow in a compound microchannels. Journal of Thermal Engineering, 11(2), 577-602. https://doi.org/10.14744/thermal.0000933

AMA

1.Shekho SS, Al Neama AF. Hydrothermal investigation of a nanofluid flow in a compound microchannels. Journal of Thermal Engineering. 2025;11(2):577-602. doi:10.14744/thermal.0000933

Chicago

Shekho, Sarab Salih, and Ahmed Fouad Al Neama. 2025. “Hydrothermal Investigation of a Nanofluid Flow in a Compound Microchannels”. Journal of Thermal Engineering 11 (2): 577-602. https://doi.org/10.14744/thermal.0000933.

EndNote

Shekho SS, Al Neama AF (March 1, 2025) Hydrothermal investigation of a nanofluid flow in a compound microchannels. Journal of Thermal Engineering 11 2 577–602.

IEEE

[1]S. S. Shekho and A. F. Al Neama, “Hydrothermal investigation of a nanofluid flow in a compound microchannels”, Journal of Thermal Engineering, vol. 11, no. 2, pp. 577–602, Mar. 2025, doi: 10.14744/thermal.0000933.

ISNAD

Shekho, Sarab Salih - Al Neama, Ahmed Fouad. “Hydrothermal Investigation of a Nanofluid Flow in a Compound Microchannels”. Journal of Thermal Engineering 11/2 (March 1, 2025): 577-602. https://doi.org/10.14744/thermal.0000933.

JAMA

1.Shekho SS, Al Neama AF. Hydrothermal investigation of a nanofluid flow in a compound microchannels. Journal of Thermal Engineering. 2025;11:577–602.

MLA

Shekho, Sarab Salih, and Ahmed Fouad Al Neama. “Hydrothermal Investigation of a Nanofluid Flow in a Compound Microchannels”. Journal of Thermal Engineering, vol. 11, no. 2, Mar. 2025, pp. 577-02, doi:10.14744/thermal.0000933.

Vancouver

1.Sarab Salih Shekho, Ahmed Fouad Al Neama. Hydrothermal investigation of a nanofluid flow in a compound microchannels. Journal of Thermal Engineering. 2025 Mar. 1;11(2):577-602. doi:10.14744/thermal.0000933