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Year 2020, Volume: 6 Issue: 6 - Special Issue 12: 22nd Thermal Science and Technology Congress, 354 - 368, 01.12.2020
https://doi.org/10.18186/thermal.833582

Abstract

References

  • [1] Sousa JMM, Vogado J, Costa M, Bensler H, Freek C, Heath D. An experimental investigation of fluid flow and wall temperature distributions in an automotive headlight. International Journal of Heat and Fluid Flow 2005;26:709–21. https://doi.org/10.1016/j.ijheatfluidflow.2005.05.003.
  • [2] Weng CJ. Advanced thermal enhancement and management of LED packages. International Communications in Heat and Mass Transfer 2009;36:245–8. https://doi.org/10.1016/j.icheatmasstransfer.2008.11.015.
  • [3] Tsai MY, Chen CH, Kang CS. Thermal measurements and analyses of low-cost high-power LED packages and their modules. Microelectronics Reliability 2012;52:845–54. https://doi.org/10.1016/j.microrel.2011.04.008.
  • [4] Jung ED, Lee YL. Study on the development of LED headlamps for used cars. Transactions on Electrical and Electronic Materials 2014;15:270–4. https://doi.org/10.4313/TEEM.2014.15.5.270.
  • [5] Kaya M. Experimental Study on Active Cooling Systems Used for Thermal Management of High-Power Multichip Light-Emitting Diodes. Scientific World Journal 2014;. http://dx.doi.org/10.1155/2014/563805.
  • [6] Wang J, Zhao X, Cai Y, Zhang C, Bao W. Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package. Energy Conversion and Management 2015;101:532–40. https://doi.org/10.1016/j.enconman.2015.05.040.
  • [7] Sökmen KF, Yürüklü E, Yamankaradeniz N. Computational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications. Applied Thermal Engineering 2016;94:534–42. https://doi.org/10.1016/j.applthermaleng.2015.10.069.
  • [8] Niculina BD, Paul S, Cristina M. Fan vs. Passive heat sinks for cooling high power COB-type LEDs. Proceedings of the 9th International Conference on Electronics, Computers and Artificial Intelligence, ECAI 2017 2017;2017-Janua:1–4. https://doi.org/10.1109/ECAI.2017.8166477.
  • [9] Sufian SF, Fairuz ZM, Zubair M, Abdullah MZ, Mohamed JJ. Thermal analysis of dual piezoelectric fans for cooling multi-LED packages. Microelectronics Reliability 2014;54:1534–43. https://doi.org/10.1016/j.microrel.2014.03.016.
  • [10] Singh R, Jalilvand A, Goto K, Mashiko K, Saito Y, Mochizuki M. Direct impingement cooling of LED by Piezo fan. 2014 International Conference on Electronics Packaging, ICEP 2014 2014:1–5. https://doi.org/10.1109/ICEP.2014.6826650.
  • [11] Fu HK, Wang CP, Chiang HC, Chen T Te, Chen CL, Chou PT. Evaluation of temperature distribution of LED module. Microelectronics Reliability 2013;53:554–9. https://doi.org/10.1016/j.microrel.2012.11.009.
  • [12] Maaspuro M, Tuominen A. Microelectronics Reliability Thermal analysis of LED spot lighting device operating in external natural or forced heat convection. Microelectronics Reliability 2013;53:428–34. https://doi.org/10.1016/j.microrel.2012.10.004.
  • [13] Wang J, Cai YX, Zhao XJ, Zhang C. Thermal design and simulation of automotive headlamps using white LEDs. Microelectronics Journal 2014;45:249–55. https://doi.org/10.1016/j.mejo.2013.11.011.
  • [14] Su YF, Yang SY, Hung TY, Lee CC, Chiang KN. Light degradation test and design of thermal performance for high-power light-emitting diodes. Microelectronics Reliability 2012;52:794–803. https://doi.org/10.1016/j.microrel.2011.07.059.
  • [15] Shih K. LED Junction Temperature Measurement and its Applications to Automotive Lamp Design. SAE Technical Paper 2004. https://doi.org/10.4271/2004-01-0224.
  • [16] Colaco AM, Kurian CP, Kini SG, Colaco SG, Johny C. Thermal characterization of multicolor LED luminaire. Microelectronics Reliability 2017;78:379–88. https://doi.org/10.1016/j.microrel.2017.04.026.
  • [17] J. P. Holman. Experimental methods for engineers. 8th ed. McGrawHill; 2012.
  • [18] Lampio K, Karvinen R. Optimization of convectively cooled heat sinks. Microelectronics Reliability 2017;79:473–9. https://doi.org/10.1016/j.microrel.2017.06.011.
  • [19] Rammohan A, Kumar Ramesh C. A review on effect of thermal factors on performance of high power light emitting diode (HPLED). Journal of Engineering Science and Technology Review 2016;9:165-76. https://doi.org/10.25103/jestr.094.24.
  • [20] Dongmei Zhou and Timothy Rau. Thermal design methodology and prediction of heat sink performance. Journal of Thermal Engineering 2016;2:826–36. https://doi.org/10.18186/jte.29129.
  • [21] Abu M, Alt V. The Effect of Blowing Direction on Heat Sink Performance. Journal of Thermal Engineering 2018;4:2471–80 2018;4:2471–80. https://doi.org/10.18186/thermal.465695.

AUTOMOTIVE HEADLAMP HIGH POWER LED COOLING SYSTEM AND ITS EFFECT ON JUNCTION TEMPERATURE AND LIGHT INTENSITY

Year 2020, Volume: 6 Issue: 6 - Special Issue 12: 22nd Thermal Science and Technology Congress, 354 - 368, 01.12.2020
https://doi.org/10.18186/thermal.833582

Abstract

Halogen bulbs are sources of light of headlamps of most of the vehicles running around the world. To get better night vision, vehicle owners want to replace the conventional halogen bulbs with HPLEDs without replacing the conventional headlamp assembly. Though High Power Light Emitting Diodes (HPLED) are efficient sources of light for replacing halogen bulbs, conventional headlamps are not designed for HPLEDs and so replaced HPLEDs will fail within a short duration due to poor cooling. The aim of this work is to develop a compact cooling system for a conventional headlamp assembly to accommodate HPLEDs. An air cooled system with a compact heat sink is proposed in this work. To decide the dimensions of the compact heat sink various heatsink sizes were modeled and simulated in ANSYS. For this study, a popular SUV's headlamp is chosen and complete tests were carried out in absence of external lights on a flat black surface for about 28 meters. The light intensity is measured in terms of lux for Halogen and HPLED's horizontal passing beam at various test points. For generating the same intensity of light, it was found from the experimental results that the HPLED consumes only one third of the energy supplied to halogen bulbs. With the proposed cooling system the junction temperature was reduced by about 25% when the cooling fan is operated at laminar flow conditions. On the other hand, the luminous intensity of the HPLED improved by about 30.9% due to the decrease in junction temperature. The HPLED headlamp reflector inner wall temperature is found to be 49 % lesser than Halogen bulb headlamp reflector inner wall temperature.

References

  • [1] Sousa JMM, Vogado J, Costa M, Bensler H, Freek C, Heath D. An experimental investigation of fluid flow and wall temperature distributions in an automotive headlight. International Journal of Heat and Fluid Flow 2005;26:709–21. https://doi.org/10.1016/j.ijheatfluidflow.2005.05.003.
  • [2] Weng CJ. Advanced thermal enhancement and management of LED packages. International Communications in Heat and Mass Transfer 2009;36:245–8. https://doi.org/10.1016/j.icheatmasstransfer.2008.11.015.
  • [3] Tsai MY, Chen CH, Kang CS. Thermal measurements and analyses of low-cost high-power LED packages and their modules. Microelectronics Reliability 2012;52:845–54. https://doi.org/10.1016/j.microrel.2011.04.008.
  • [4] Jung ED, Lee YL. Study on the development of LED headlamps for used cars. Transactions on Electrical and Electronic Materials 2014;15:270–4. https://doi.org/10.4313/TEEM.2014.15.5.270.
  • [5] Kaya M. Experimental Study on Active Cooling Systems Used for Thermal Management of High-Power Multichip Light-Emitting Diodes. Scientific World Journal 2014;. http://dx.doi.org/10.1155/2014/563805.
  • [6] Wang J, Zhao X, Cai Y, Zhang C, Bao W. Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package. Energy Conversion and Management 2015;101:532–40. https://doi.org/10.1016/j.enconman.2015.05.040.
  • [7] Sökmen KF, Yürüklü E, Yamankaradeniz N. Computational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications. Applied Thermal Engineering 2016;94:534–42. https://doi.org/10.1016/j.applthermaleng.2015.10.069.
  • [8] Niculina BD, Paul S, Cristina M. Fan vs. Passive heat sinks for cooling high power COB-type LEDs. Proceedings of the 9th International Conference on Electronics, Computers and Artificial Intelligence, ECAI 2017 2017;2017-Janua:1–4. https://doi.org/10.1109/ECAI.2017.8166477.
  • [9] Sufian SF, Fairuz ZM, Zubair M, Abdullah MZ, Mohamed JJ. Thermal analysis of dual piezoelectric fans for cooling multi-LED packages. Microelectronics Reliability 2014;54:1534–43. https://doi.org/10.1016/j.microrel.2014.03.016.
  • [10] Singh R, Jalilvand A, Goto K, Mashiko K, Saito Y, Mochizuki M. Direct impingement cooling of LED by Piezo fan. 2014 International Conference on Electronics Packaging, ICEP 2014 2014:1–5. https://doi.org/10.1109/ICEP.2014.6826650.
  • [11] Fu HK, Wang CP, Chiang HC, Chen T Te, Chen CL, Chou PT. Evaluation of temperature distribution of LED module. Microelectronics Reliability 2013;53:554–9. https://doi.org/10.1016/j.microrel.2012.11.009.
  • [12] Maaspuro M, Tuominen A. Microelectronics Reliability Thermal analysis of LED spot lighting device operating in external natural or forced heat convection. Microelectronics Reliability 2013;53:428–34. https://doi.org/10.1016/j.microrel.2012.10.004.
  • [13] Wang J, Cai YX, Zhao XJ, Zhang C. Thermal design and simulation of automotive headlamps using white LEDs. Microelectronics Journal 2014;45:249–55. https://doi.org/10.1016/j.mejo.2013.11.011.
  • [14] Su YF, Yang SY, Hung TY, Lee CC, Chiang KN. Light degradation test and design of thermal performance for high-power light-emitting diodes. Microelectronics Reliability 2012;52:794–803. https://doi.org/10.1016/j.microrel.2011.07.059.
  • [15] Shih K. LED Junction Temperature Measurement and its Applications to Automotive Lamp Design. SAE Technical Paper 2004. https://doi.org/10.4271/2004-01-0224.
  • [16] Colaco AM, Kurian CP, Kini SG, Colaco SG, Johny C. Thermal characterization of multicolor LED luminaire. Microelectronics Reliability 2017;78:379–88. https://doi.org/10.1016/j.microrel.2017.04.026.
  • [17] J. P. Holman. Experimental methods for engineers. 8th ed. McGrawHill; 2012.
  • [18] Lampio K, Karvinen R. Optimization of convectively cooled heat sinks. Microelectronics Reliability 2017;79:473–9. https://doi.org/10.1016/j.microrel.2017.06.011.
  • [19] Rammohan A, Kumar Ramesh C. A review on effect of thermal factors on performance of high power light emitting diode (HPLED). Journal of Engineering Science and Technology Review 2016;9:165-76. https://doi.org/10.25103/jestr.094.24.
  • [20] Dongmei Zhou and Timothy Rau. Thermal design methodology and prediction of heat sink performance. Journal of Thermal Engineering 2016;2:826–36. https://doi.org/10.18186/jte.29129.
  • [21] Abu M, Alt V. The Effect of Blowing Direction on Heat Sink Performance. Journal of Thermal Engineering 2018;4:2471–80 2018;4:2471–80. https://doi.org/10.18186/thermal.465695.
There are 21 citations in total.

Details

Primary Language English
Subjects Engineering
Journal Section Articles
Authors

Ramesh Kumar Chidambaram This is me 0000-0002-7446-1948

Rammohan Arunachalam This is me 0000-0002-7359-6648

Publication Date December 1, 2020
Submission Date March 29, 2019
Published in Issue Year 2020 Volume: 6 Issue: 6 - Special Issue 12: 22nd Thermal Science and Technology Congress

Cite

APA Chidambaram, R. K., & Arunachalam, R. (2020). AUTOMOTIVE HEADLAMP HIGH POWER LED COOLING SYSTEM AND ITS EFFECT ON JUNCTION TEMPERATURE AND LIGHT INTENSITY. Journal of Thermal Engineering, 6(6), 354-368. https://doi.org/10.18186/thermal.833582
AMA Chidambaram RK, Arunachalam R. AUTOMOTIVE HEADLAMP HIGH POWER LED COOLING SYSTEM AND ITS EFFECT ON JUNCTION TEMPERATURE AND LIGHT INTENSITY. Journal of Thermal Engineering. December 2020;6(6):354-368. doi:10.18186/thermal.833582
Chicago Chidambaram, Ramesh Kumar, and Rammohan Arunachalam. “AUTOMOTIVE HEADLAMP HIGH POWER LED COOLING SYSTEM AND ITS EFFECT ON JUNCTION TEMPERATURE AND LIGHT INTENSITY”. Journal of Thermal Engineering 6, no. 6 (December 2020): 354-68. https://doi.org/10.18186/thermal.833582.
EndNote Chidambaram RK, Arunachalam R (December 1, 2020) AUTOMOTIVE HEADLAMP HIGH POWER LED COOLING SYSTEM AND ITS EFFECT ON JUNCTION TEMPERATURE AND LIGHT INTENSITY. Journal of Thermal Engineering 6 6 354–368.
IEEE R. K. Chidambaram and R. Arunachalam, “AUTOMOTIVE HEADLAMP HIGH POWER LED COOLING SYSTEM AND ITS EFFECT ON JUNCTION TEMPERATURE AND LIGHT INTENSITY”, Journal of Thermal Engineering, vol. 6, no. 6, pp. 354–368, 2020, doi: 10.18186/thermal.833582.
ISNAD Chidambaram, Ramesh Kumar - Arunachalam, Rammohan. “AUTOMOTIVE HEADLAMP HIGH POWER LED COOLING SYSTEM AND ITS EFFECT ON JUNCTION TEMPERATURE AND LIGHT INTENSITY”. Journal of Thermal Engineering 6/6 (December 2020), 354-368. https://doi.org/10.18186/thermal.833582.
JAMA Chidambaram RK, Arunachalam R. AUTOMOTIVE HEADLAMP HIGH POWER LED COOLING SYSTEM AND ITS EFFECT ON JUNCTION TEMPERATURE AND LIGHT INTENSITY. Journal of Thermal Engineering. 2020;6:354–368.
MLA Chidambaram, Ramesh Kumar and Rammohan Arunachalam. “AUTOMOTIVE HEADLAMP HIGH POWER LED COOLING SYSTEM AND ITS EFFECT ON JUNCTION TEMPERATURE AND LIGHT INTENSITY”. Journal of Thermal Engineering, vol. 6, no. 6, 2020, pp. 354-68, doi:10.18186/thermal.833582.
Vancouver Chidambaram RK, Arunachalam R. AUTOMOTIVE HEADLAMP HIGH POWER LED COOLING SYSTEM AND ITS EFFECT ON JUNCTION TEMPERATURE AND LIGHT INTENSITY. Journal of Thermal Engineering. 2020;6(6):354-68.

IMPORTANT NOTE: JOURNAL SUBMISSION LINK http://eds.yildiz.edu.tr/journal-of-thermal-engineering