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DETERMINATION OF THERMAL CONDUCTIVITY OF LAMINATED WOOD MATERIALS DEPENDING ON THE LAYER ORIENTATION

Year 2021, Volume: 3 Issue: 2, 31 - 36, 25.12.2021

Abstract

In this study, it was aimed to determine the thermal conductivity coefficient values of laminated wood materials produced with different layer orientation, according to wood species and adhesive type. For this purpose, 5-layers plywood, laminated veneer lumber (LVL), Kerto-Q-LVL and special type plywood (Q-plywood), which formed three rotary cut veneers in the inner layer parallel to each other, perpendicular to the outer layers, panels were produced. In the production of the panels, poplar (Populus deltoides), Scots pine (Pinus sylvestris L.) and spruce (Picea orientalis L.) were used as a wood species and was used urea formaldehyde (UF) and phenol formaldehyde (PF) as adhesive types. The thermal conductivity coefficient measurements of the panels were carried out according to the ASTM C 518 standard. As a results of the study, the highest thermal conductivity coefficient value was obtained from Q-LVL panels produced using UF adhesive from spruce veneers. The lowest thermal conductivity values were obtained from plywood produced using PF adhesive from spruce veneers.

References

  • ASTM C 518. (2004). Methots of Measuring Thermal Conductivity, Absolute and Reference Method. ASTM International: West Conshohocken, USA.
  • Berkel, A. 1970. Ağaç Malzeme Teknolojisi, İstanbul Üniversitesi, Orman Fakültesi Yayınları, Yayın no: 147.
  • Demirkır, C., (2012). Using Possibilities of Pine Species in Turkey for Structural Plywood Manufacturing. PhD Thesis, Karadeniz Technical University, Institute of Science and Technology, Trabzon.
  • Gu, H. M. and Hunt, J. F. (2007). Two-dimensional finite element heat transfer model of softwood. Part III, Effect of moisture content on thermal conductivity. Wood Fiber Sci., 39, 159.
  • Gu, H.M. and Zink-Sharp, A. (2005). Geometric model for softwood transverse thermal conductivity. Part I. Wood and Fiber Sci 37(4): 699-711.
  • Kamke, A.F. and Zylkowoski, S.C. (1989). Effects of Wood –Based Panel Characteristics on Thermal Conductivity. Forest Products Journal., Volume 39 no:5 p:39-24
  • Kawasaki, T. and Kawai, S. (2006). Thermal Insulation Properties of Wood-Based Sandwich panel for use as structural insulated walls and floors. Japan Wood research Society, 52, 75-83.
  • Keskin, H. (2003). Some physical and mechanical properties of laminated oriental spruce (Picea orientalis Lipsky) wood. Journal of Süleyman Demirel University Faculty of Forestry, A (1): 139-151.
  • Kol, H. S. (2009). The Transverse Thermal Conductivity Coefficients of Some Hardwood Species Grown in Turkey, Forest Products Journal, 10, 59, 58-63.
  • Kol, H. S. and Sefil, Y. (2011). The thermal conductivity of Fir and Beech Wood Heat Treated at 170, 180, 190, 200 and 212°C, Journal of Applied Polymer Science, 121, 2473-2480.
  • Kol, H.S., Ozcifci, A. and Altun, S. (2008). Effect of some chemicals on thermal conductivity of laminated veneer lumbers manufactured with urea formaldehyde and phenol formaldehyde adhesives. Kastamonu University J of Forestry Faculty 8(2): 125-130.
  • Kollmann, F.F.P. and Cote, W.A. (1968). Principles of wood science and technology. Berlin: Springer-Verlag.
  • Kruger, E.L. and Adriazola, M.K.O. (2010). Thermal analysis of wood-based test cells. Constr Build Mater 24: 999–1007.
  • Kurt, Ş., Uysal, B. and Özcan, C. (2008). Effect of Adhesives on thermal conductivity of laminated veneer lumber. Journal of Applied Polymer Science, 110, 3, 1822.
  • Öztürk R.B., ve Arıoğlu N., (2006). Mechanical properties of laminated wood beams produced from Turkish Pinus silvestris. ITU Journal, architecture, planning, design,5(2), 25-36.
  • Perçin, O., Özbay, G., ve Ordu, M.., (2009). The Investigation of the Mechanical Properties of Wooden Materials Laminated with Various Glues. Dumlupınar University Journal of Science Institute, 19, 109-120.
  • Rice, R. W. and Shepard, R. (2004). The Thermal Conductivity of Plantation Grown White Pine (Pinus strobus) and Red Pine (Pinus resinosa) at two moisture content levels”, Forest Products Journal, 54, 1, 92-94.
  • Şenay, A., (1996). Mechanical and Physical Properties of Laminated Oriental Beech (Fagus orientalis Lipsky), PhD Thesis, Istanbul University, Institute of Science and Technology, Istanbul.
  • Simpson, W. and Tenwolde, A. (2007). Chapter 3. Physical Properties and Moisture Relations of Wood. The Encyclopedia of Wood. U.S. Department of Agriculture Forest Service, Forest Products Laboratory, Madison, Wisconsin: Skyhorse Publishing.
Year 2021, Volume: 3 Issue: 2, 31 - 36, 25.12.2021

Abstract

References

  • ASTM C 518. (2004). Methots of Measuring Thermal Conductivity, Absolute and Reference Method. ASTM International: West Conshohocken, USA.
  • Berkel, A. 1970. Ağaç Malzeme Teknolojisi, İstanbul Üniversitesi, Orman Fakültesi Yayınları, Yayın no: 147.
  • Demirkır, C., (2012). Using Possibilities of Pine Species in Turkey for Structural Plywood Manufacturing. PhD Thesis, Karadeniz Technical University, Institute of Science and Technology, Trabzon.
  • Gu, H. M. and Hunt, J. F. (2007). Two-dimensional finite element heat transfer model of softwood. Part III, Effect of moisture content on thermal conductivity. Wood Fiber Sci., 39, 159.
  • Gu, H.M. and Zink-Sharp, A. (2005). Geometric model for softwood transverse thermal conductivity. Part I. Wood and Fiber Sci 37(4): 699-711.
  • Kamke, A.F. and Zylkowoski, S.C. (1989). Effects of Wood –Based Panel Characteristics on Thermal Conductivity. Forest Products Journal., Volume 39 no:5 p:39-24
  • Kawasaki, T. and Kawai, S. (2006). Thermal Insulation Properties of Wood-Based Sandwich panel for use as structural insulated walls and floors. Japan Wood research Society, 52, 75-83.
  • Keskin, H. (2003). Some physical and mechanical properties of laminated oriental spruce (Picea orientalis Lipsky) wood. Journal of Süleyman Demirel University Faculty of Forestry, A (1): 139-151.
  • Kol, H. S. (2009). The Transverse Thermal Conductivity Coefficients of Some Hardwood Species Grown in Turkey, Forest Products Journal, 10, 59, 58-63.
  • Kol, H. S. and Sefil, Y. (2011). The thermal conductivity of Fir and Beech Wood Heat Treated at 170, 180, 190, 200 and 212°C, Journal of Applied Polymer Science, 121, 2473-2480.
  • Kol, H.S., Ozcifci, A. and Altun, S. (2008). Effect of some chemicals on thermal conductivity of laminated veneer lumbers manufactured with urea formaldehyde and phenol formaldehyde adhesives. Kastamonu University J of Forestry Faculty 8(2): 125-130.
  • Kollmann, F.F.P. and Cote, W.A. (1968). Principles of wood science and technology. Berlin: Springer-Verlag.
  • Kruger, E.L. and Adriazola, M.K.O. (2010). Thermal analysis of wood-based test cells. Constr Build Mater 24: 999–1007.
  • Kurt, Ş., Uysal, B. and Özcan, C. (2008). Effect of Adhesives on thermal conductivity of laminated veneer lumber. Journal of Applied Polymer Science, 110, 3, 1822.
  • Öztürk R.B., ve Arıoğlu N., (2006). Mechanical properties of laminated wood beams produced from Turkish Pinus silvestris. ITU Journal, architecture, planning, design,5(2), 25-36.
  • Perçin, O., Özbay, G., ve Ordu, M.., (2009). The Investigation of the Mechanical Properties of Wooden Materials Laminated with Various Glues. Dumlupınar University Journal of Science Institute, 19, 109-120.
  • Rice, R. W. and Shepard, R. (2004). The Thermal Conductivity of Plantation Grown White Pine (Pinus strobus) and Red Pine (Pinus resinosa) at two moisture content levels”, Forest Products Journal, 54, 1, 92-94.
  • Şenay, A., (1996). Mechanical and Physical Properties of Laminated Oriental Beech (Fagus orientalis Lipsky), PhD Thesis, Istanbul University, Institute of Science and Technology, Istanbul.
  • Simpson, W. and Tenwolde, A. (2007). Chapter 3. Physical Properties and Moisture Relations of Wood. The Encyclopedia of Wood. U.S. Department of Agriculture Forest Service, Forest Products Laboratory, Madison, Wisconsin: Skyhorse Publishing.
There are 19 citations in total.

Details

Primary Language English
Subjects Timber, Pulp and Paper, Material Characterization
Journal Section Research Articles
Authors

Özkan Cırrık 0000-0002-0119-7509

Publication Date December 25, 2021
Acceptance Date November 26, 2021
Published in Issue Year 2021 Volume: 3 Issue: 2

Cite

APA Cırrık, Ö. (2021). DETERMINATION OF THERMAL CONDUCTIVITY OF LAMINATED WOOD MATERIALS DEPENDING ON THE LAYER ORIENTATION. Wood Industry and Engineering, 3(2), 31-36.
AMA Cırrık Ö. DETERMINATION OF THERMAL CONDUCTIVITY OF LAMINATED WOOD MATERIALS DEPENDING ON THE LAYER ORIENTATION. WI&E. December 2021;3(2):31-36.
Chicago Cırrık, Özkan. “DETERMINATION OF THERMAL CONDUCTIVITY OF LAMINATED WOOD MATERIALS DEPENDING ON THE LAYER ORIENTATION”. Wood Industry and Engineering 3, no. 2 (December 2021): 31-36.
EndNote Cırrık Ö (December 1, 2021) DETERMINATION OF THERMAL CONDUCTIVITY OF LAMINATED WOOD MATERIALS DEPENDING ON THE LAYER ORIENTATION. Wood Industry and Engineering 3 2 31–36.
IEEE Ö. Cırrık, “DETERMINATION OF THERMAL CONDUCTIVITY OF LAMINATED WOOD MATERIALS DEPENDING ON THE LAYER ORIENTATION”, WI&E, vol. 3, no. 2, pp. 31–36, 2021.
ISNAD Cırrık, Özkan. “DETERMINATION OF THERMAL CONDUCTIVITY OF LAMINATED WOOD MATERIALS DEPENDING ON THE LAYER ORIENTATION”. Wood Industry and Engineering 3/2 (December 2021), 31-36.
JAMA Cırrık Ö. DETERMINATION OF THERMAL CONDUCTIVITY OF LAMINATED WOOD MATERIALS DEPENDING ON THE LAYER ORIENTATION. WI&E. 2021;3:31–36.
MLA Cırrık, Özkan. “DETERMINATION OF THERMAL CONDUCTIVITY OF LAMINATED WOOD MATERIALS DEPENDING ON THE LAYER ORIENTATION”. Wood Industry and Engineering, vol. 3, no. 2, 2021, pp. 31-36.
Vancouver Cırrık Ö. DETERMINATION OF THERMAL CONDUCTIVITY OF LAMINATED WOOD MATERIALS DEPENDING ON THE LAYER ORIENTATION. WI&E. 2021;3(2):31-6.

Wood Industry and Engineering Journal
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