MEMS kapasitif ivmeölçer: Bir inceleme

Yıl 2023, , 41 - 58, 31.12.2023

Cihat Ediz Akbaba , Yusuf Tanrıkulu

https://doi.org/10.55198/artibilimfen.1386846

Cited By: 1

Öz

Mikro-elektro-mekanik sistem sensörleri tüketici elektroniği, otomobil endüstrisi, biyomedikal gibi birçok alanda kullanılan, boyutları mikrometre ile milimetre arasında değişen entegre sistemlerdir. MEMS kapasitif ivmeölçerler, MEMS ivmeölçer sensörleri arasında en yaygın kullanılan sensör türüdür. Kapasitif ivmeölçer sensörüne uygulanan dış kuvvet sonucunda sensörün içindeki kanıt kütlesi hareket eder ve kapasitif değişim, okuma devreleri kullanılarak elektrik sinyali olarak ölçülür. Bu inceleme yazısında MEMS sensörleri hakkında genel bilgiler verilmiş olup, MEMS kapasitif ivmeölçerler hakkında kapsamlı bir inceleme yapılmıştır. Çalışmada MEMS kapasitif ivmeölçerin dinamik devresi verilmiş, kapasitif MEMS ivmeölçerin tasarımı sırasında mekanik ve elektronik yapı için önemli değerlerin hesaplanması anlatılmıştır. Ayrıca kapasitif değişimi gerilime dönüştürmek için kullanılan okuma devreleri hakkında da bilgi verilmiştir. Son olarak nihai ürünü üretmek için kullanılan imalat süreçleri açıklanmış ve literatürde bulunan örnek imalat süreçlerine ilişkin çalışmalara değinilmiştir.

Anahtar Kelimeler

Kapasitif ivmeölçer, MEMS ivmeölçer, MEMS kapasitif ivmeölçer

MEMS capacitive accelerometer: A review

Öz

Micro-electro-mechanical systems sensors are integrated systems used in many fields such as consumer electronics, the automobile industry, and biomedical, and their dimensions change between micrometers and millimeters. MEMS capacitive accelerometers are the most widely used sensor type among MEMS accelerometer sensors. As a result of the external force applied to the capacitive accelerometer sensor, the proof mass inside the sensor moves, and the capacitive change is measured as an electrical signal using reading circuits. In this review paper, general information about MEMS sensors is given, and a comprehensive review is made of MEMS capacitive accelerometers. In the study, the dynamic circuit of the MEMS capacitive accelerometer is given, and the calculation of the important values for the mechanical and electronic structure during the design of the capacitive MEMS accelerometer is explained. In addition, information about the readout circuits used to convert the capacitive change to voltage is given. Finally, the fabrication processes used to produce the final product are explained, and the studies on sample fabrication processes found in the literature are mentioned.

Anahtar Kelimeler

Capacitive accelerometer, MEMS accelerometer, MEMS capacitive accelerometer, MEMS devices

Kaynakça

• Fujita, H. (1997). A decade of MEMS and its future. In Proceedings of the Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots, 1-7.
• Mishra, M.K., Dubey, V., Mishra, P., Khan, I. (2019). MEMS technology: a review. Journal of Engineering Research Reports, 1-24, doi:10.9734/JERR/2019/v4i116891.
• Hristov, M.H., Ruskov, S.I., Denishev, K.H., Uzunov, I.S., Grozdanov, V.E., Gaydazhiev, D.G. (2009). Design and simulation of horizontal accelerometers. Annual Journal of Electronıcs.
• Vajargah, M.K., Shamsi, H. (2023). An accurate Verilog-A based model for MEMS capacitive accelerometer. AEU-International Journal of Electronics Communications, 164, 154625, doi:10.1016/j.aeue.2023.154625.
• Liu, C.-H., Chang, H.-D., Li, K.-H., Lin, C.-H., Hsu, C.-J., Lin, T.-Y., Chou, H.-H., Huang, H.-C., Liao, H.Y.(2013). Adaptable and integrated packaging platform for MEMS-based combo sensors utilizing innovative wafer-level packaging technologies. In Proceedings of the 2013 IEEE 63rd Electronic Components and Technology Conference,1675-1681.
• Pannaga, N., Rai.P, R.(2013). Review: MEMS fabrication technology. International Journal of Engineering Research & Technology (IJERT) 02.
• Partnership, P.F. (2002). An introduction to MEMS (micro-electromechanical systems). Prime Faraday Partnership.
• Niekiel, M.F., Meyer, J.M., Lewitz, H., Kittmann, A., Nowak, M.A., Lofink, F., Meyners, D., Zollondz, J.H.(2023). What MEMS research and development can learn from a production environment. Sensors, 23, 5549, doi:10.3390/s23125549.
• Gad-el-Hak, M.(2005). MEMS: design and fabrication; CRC press.
• Judy, J.W.(2001). Microelectromechanical systems (MEMS): fabrication, design and applications. Smart Materials Structures,10, 1115, doi:10.1088/0964-1726/10/6/301.
• Kovacs, G.T., Maluf, N.I., Petersen, K.E.(1998). Bulk micromachining of silicon. Proceedings of the IEEE, 86, 1536-1551.
• Pal, P., Swarnalatha, V., Rao, A.V.N., Pandey, A.K., Tanaka, H., Sato, K. (2021). High speed silicon wet anisotropic etching for applications in bulk micromachining: A review. Micro Nano Systems Letters, 9, 1-59, doi:10.1186/s40486-021-00129-0.
• Ghodssi, R., Lin, P. (2011). MEMS materials and processes handbook; Springer Science & Business Media: Volume 1.
• Cheung, R., Argyrakis, P. (2008). Microscale sensors based on silicon carbide and silicon. Proceedings of the Institution of Mechanical Engineers, 222, 19-26, doi:10.1243/09544062JMES663.
• Antonello, R., Oboe, R. (2011). MEMS gyroscopes for consumer and industrial applications. Microsensors, Intech, 253-280, doi:10.5772/17689.
• Mamilla, V.R., Chakradhar, K.S. (2014). Micro machining for micro electro mechanical systems (MEMS). Procedia Materials Science, 6, 1170-1177, doi:10.1016/j.mspro.2014.07.190.
• Almuramady, N. (2017). Dry friction between rough surfaces of silicon and functionalized gear microelectromechanical systems. Cardiff University.
• Meyer, P., Schulz, J., Hahn, L. (2003). DoseSim: Microsoft-Windows graphical user interface for using synchrotron x-ray exposure and subsequent development in the LIGA process. Review of Scientific Instruments, 74, 1113-1119, doi:10.1063/1.1532542.
• Timoshkov, I.V., Khanko, A.V., Kurmashev, V.I., Grapov, D.V., Kastevich, A., Govor, G.A., Vetcher, A.K. (2019). Applications of uv-liga and grayscale lithography for display technologies. Доклады Белорусского государственного университета информатики и радиоэлектроники, doi:10.35596/1729-7648-2019-125-7-81-87.
• Victorino, M., Jiang, X., Menon, C. (2018). Wearable technologies and force myography for healthcare. In Wearable Technology in Medicine and Health Care; Academic Press,135-152.
• Erdener, Ö. (2005). MEMS Accelerometer Design. MS Thesis, İstanbul Teknik Üniversitesi,İstanbul.
• Suh, M. (2015). Wearable sensors for athletes. In Electronic Textiles; Elsevier: 257-273.
• Yoder, N., Adams, D. (2014). Commonly used sensors for civil infrastructures and their associated algorithms. In Sensor Technologies for Civil Infrastructures; Elsevier: 57-85.
• Casas-Ramos, M.A., Castillo-Barrera, L.G., Sandoval-Romero, G. (2018). Optical accelerometer for seismic measurement. Vibroengineering PROCEDIA, 21, 38-41, doi:10.21595/vp.2018.20379.
• Plaza, J.A., Llobera, A., Dominguez, C., Esteve, J., Salinas, I., Garcia, J., Berganzo, J. (2004). BESOI-based integrated optical silicon accelerometer. Journal of Microelectromechanical Systems, 13, 355-364, doi:10.1109/JMEMS.2004.824884.
• Venkatanarayanan, A., Spain, E. (2014). Review of recent developments in sensing materials. Comprehensive Materials Processing, 13, 47-101, doi:10.1016/B978-0-08-096532-1.01303-0.
• Gomathi, T., Shaby, S.M.(2016). Capacitive accelerometers for microelectromechanical applications: a review. In Proceedings of the 2016 International Conference on Control, Instrumentation, Communication and Computational Technologies (ICCICCT), 486-490.
• Kesilmiş, Z., Mutlu, A., Aksoy, M. (2008). Yapay sinir ağı ile kapasitif MEMS ivme ölçerin rezonans frekansı kestirimi. Elektrik-Elektronik Bilgisayar Mühendisliği Sempozyumu ELECO’2008, Türkiye, 26 - 29 Kasım, 87-90
• Sinha, S., Shakya, S., Mukhiya, R., Gopal, R., Pant, B. (2014). Design and simulation of MEMS differential capacitive accelerometer. In Proceedings of the Proceeding of ISSS international conference on smart materials, structures and systems.
• Zou, X., Seshia, A.A. (2015). A high-resolution resonant MEMS accelerometer. In Proceedings of the 2015 Transducers-2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 1247-1250.
• Aizawa, T., Kimura, T., Matsuoka, T., Takeda, T., Asano, Y. (2009). Application of MEMS accelerometer to geophysics. International Journal of the JCRM, 4, 33-36, doi:10.11187/ijjcrm.4.33.
• Nie, Y., Huang, K., Yang, J., Cao, L., Cheng, L., Wang, Q., Tian, H., Peihua, W., Heng, L. (2020). A proposal to enhance high-frequency optical MEMS accelerometer sensitivity based on a one-dimensional photonic crystal wavelength modulation system. IEEE Sensors Journal, 20, 14639-14645, doi:10.1109/JSEN.2020.3006220.
• Yazıcıoğlu, R.F. (2003). Surface micromachined capacitive accelerometers using mems technology. Middle East Technical University.
• Delfan Hemmati, K., Azizollah Ganji, B. (2022). Increase of three-axis accelerometer sensitivity using capacitor in spring. Journal of Electrical Engineering, 54, 97-106, doi:10.22060/eej.2021.20123.5420.
• Tan, S.-S., Liu, C.-Y., Yeh, L.-K., Chiu, Y.-H., Lu, M.S.-C., Hsu, K.Y. (2010). Design of low-noise CMOS MEMS accelerometer with techniques for thermal stability and stable DC biasing. In Proceedings of the IEEE Custom Integrated Circuits Conference 2010,1-4.
• Szermer, M., Zając, P., Amrozik, P., Maj, C., Jankowski, M., Jabłoński, G., Kiełbik, R., Nazdrowicz, J., Napieralska, M., Sakowicz, B. (2021). A Capacitive 3-Axis MEMS accelerometer for medipost: A portable system dedicated to monitoring ımbalance disorders. Sensors, 21, 3564, doi:10.3390/s21103564.
• Gomathi, K., Balaji, A., Mrunalini, T. (2021). Design and optimization of differential capacitive micro accelerometer for vibration measurement. Journal of the Mechanical Behavior of Materials, 30, 19-27, doi:10.1515/jmbm-2021-0003.
• Benmessaoud, M., Nasreddine, M.M. (2013). Optimization of MEMS capacitive accelerometer. Microsystem Technologies, 19, 713-720, doi:10.1007/s00542-013-1741-z.
• Keshavarzi, M., Hasani, J.Y. (2019). Design and optimization of fully differential capacitive MEMS accelerometer based on surface micromachining. Microsystem Technologies, 25, 1369-1377, doi:10.1007/s00542-018-4187-5.
• Amini, B.V. (2006). A mixed-signal low-noise sigma-delta interface IC for integrated sub-micro-gravity capacitive SOI accelerometers. Georgia Institute of Technology.
• Yoo, Y., Choi, B.-D. (2021). Readout circuits for capacitive sensors. Micromachines, 12, 960, doi:10.3390/mi12080960.
• Zhong, L., Lai, X., Song, H., Xu, D. (2018). Differential capacitive readout circuit using oversampling successive approximation technique. IEEE Transactions on Circuits Systems I: Regular Papers, 65, 4072-4085, doi:10.1109/TCSI.2018.2849992.
• Terzioglu, Y., Alper, S.E., Azgin, K., Akin, T. (2014). A capacitive MEMS accelerometer readout with concurrent detection and feedback using discrete components. In Proceedings of the 2014 IEEE/ION Position, Location and Navigation Symposium-PLANS 2014, 12-15.
• Mukhiya, R., Agarwal, P., Badjatya, S., Garg, M., Gaikwad, P., Sinha, S., Singh, A., Gopal, R. (2019). Design, modelling and system level simulations of DRIE-based MEMS differential capacitive accelerometer. Microsystem Technologies, 25, 3521-3532, doi:10.1007/s00542-018-04292-0.
• Kavitha, S., Daniel, R.J., Sumangala, K. (2016). Design and analysis of MEMS comb drive capacitive accelerometer for SHM and seismic applications. Measurement, 93, 327-339, doi:10.1016/j.measurement.2016.07.029.
• Qu, W., Wenzel, C., Gerlach, G. (1999). Fabrication of a 3D differential-capacitive acceleration sensor by UV-LIGA. Sensors Actuators A: Physical , 77, 14-20, doi:10.1016/S0924-4247(98)00377-X.
• Zhou, X., Che, L., Liang, S., Lin, Y., Li, X., Wang, Y. (2015). Design and fabrication of a MEMS capacitive accelerometer with fully symmetrical double-sided H-shaped beam structure. Microelectronic Engineering, 131, 51-57, doi:doi.org/10.1016/j.mee.2014.10.005.