Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning

Ahmet Murat Yağci; Selim Acar

doi:10.54287/gujsa.1866197

Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning

Abstract

This article reports on the optimization of Au wire bonding for GaAs chips. The effects of bonding parameters on ball size were evaluated by measuring both the average diameter and its standard deviation. Using the parameter set with the smallest deviation, argon plasma cleaning was applied to the pads while maintaining the unchanged bonding conditions. Although the average pull strength remained nearly constant, the standard deviation decreased from 1.1 to 0.61, indicating an improvement in process consistency. These results demonstrate that plasma-assisted surface treatment provides a more consistent and reliable wire bonding process in GaAs packaging applications.

Keywords

References

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Details

Primary Language

English

Subjects

Microelectronics

Journal Section

Research Article

Authors

Ahmet Murat Yağci ^*
0000-0002-9246-3752
Türkiye

Selim Acar
0000-0003-4014-7800
Türkiye

Publication Date

March 31, 2026

Submission Date

January 18, 2026

Acceptance Date

March 3, 2026

Published in Issue

Year 2026 Volume: 13 Number: 1

DOI

https://doi.org/10.54287/gujsa.1866197

IZ

https://izlik.org/JA35XH53RL

Cite

RIS / Bibtex

APA

Yağci, A. M., & Acar, S. (2026). Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning. Gazi University Journal of Science Part A: Engineering and Innovation, 13(1), 391-403. https://doi.org/10.54287/gujsa.1866197

AMA

1.Yağci AM, Acar S. Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning. GU J Sci, Part A. 2026;13(1):391-403. doi:10.54287/gujsa.1866197

Chicago

Yağci, Ahmet Murat, and Selim Acar. 2026. “Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning”. Gazi University Journal of Science Part A: Engineering and Innovation 13 (1): 391-403. https://doi.org/10.54287/gujsa.1866197.

EndNote

Yağci AM, Acar S (March 1, 2026) Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning. Gazi University Journal of Science Part A: Engineering and Innovation 13 1 391–403.

IEEE

[1]A. M. Yağci and S. Acar, “Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning”, GU J Sci, Part A, vol. 13, no. 1, pp. 391–403, Mar. 2026, doi: 10.54287/gujsa.1866197.

ISNAD

Yağci, Ahmet Murat - Acar, Selim. “Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning”. Gazi University Journal of Science Part A: Engineering and Innovation 13/1 (March 1, 2026): 391-403. https://doi.org/10.54287/gujsa.1866197.

JAMA

1.Yağci AM, Acar S. Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning. GU J Sci, Part A. 2026;13:391–403.

MLA

Yağci, Ahmet Murat, and Selim Acar. “Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning”. Gazi University Journal of Science Part A: Engineering and Innovation, vol. 13, no. 1, Mar. 2026, pp. 391-03, doi:10.54287/gujsa.1866197.

Vancouver

1.Ahmet Murat Yağci, Selim Acar. Improved Bond Strength in Au Wire Bonding Through Process Parameter Optimization and Argon Plasma Cleaning. GU J Sci, Part A. 2026 Mar. 1;13(1):391-403. doi:10.54287/gujsa.1866197