AKTİF KARBON KAPLAMALI SOĞUTUCULARIN ANALİZ VE OPTİMİZASYONU

Year 2022, , 65 - 74, 30.04.2022

A. Alperen Günay

https://doi.org/10.47480/isibted.1107445

Abstract

Nanoteknolojideki son gelişmeler, elektronik cihazların boyutlarının küçülmesine yol açtı ve bu durum randımanlı ısıl yönetim stratejilerinin geliştirilmesini bir zorunluluk haline getirdi. Küçülen bu cihazların ısıl yönetimlerinin geliştirilecek olan verimli pasif cihazlar vasıtasıyla etkili bir şekilde gerçekleştirilebileceği öngörülmektedir. Bu çalışmada, atmosferdeki su buharının sorpsiyon döngüsü kullanılarak yapay bir buharlaşmalı soğutma etkisi oluşturulması amacıyla anotlanmış alüminyum soğutucuların üzerine bir aktif karbon tabakası kaplanmıştır. Aktif karbonun malzeme özellikleri radyasyon ve desorpsiyon ile daha fazla soğutmaya olanak sağlarken, ısı emicilerinin geometrileri yüzey alanının en üst seviyeye çıkarılmasını sağlamaktadır. İdeal soğutucu geometrisini ve optimum aktif karbon kaplama kütlesini belirlemek için sayısal benzetim platformları geliştirilmiş ve kullanılmıştır. Analiz sonuçlarına göre kanatçık çapı ve aralığı küçüldükçe, ve aktif karbon kütlesi çalışılan aralıkta (0-100 mg) arttıkça, elektronik çipin etkili bir şekilde soğutulabildiği görülmektedir. Desorpsiyon, radyasyon ve konveksiyonun etkilerini ayrı ayrı çalışabilmek için belirli girdilerle benzetme algoritmaları tekrar kullanılmıştır. Analizlerimiz, desorpsiyonun sadece erken fazlarda önemli bir rol oynadığını, radyasyon ve konveksiyon temelli soğutmanınsa denge durumundaki toplam ısı transfer katsayısında ortalama %20’lik bir artışa yol açtığını ortaya koymaktadır. Bu çalışma küçük elektronik cihazların pasif yöntemlerle soğutulmalarına yönelik stratejiler geliştirmenin ötesinde, ısıl cihazların zamana bağlı etkili bir şekilde çalışmaları için kütle difüzyonu ve ısıl prosesler arasında bir bağlantı kurmaktadır.

Keywords

Isıl yönetim, Aktif karbon, Pasif cihazlar, Isı emici.

ANALYSIS AND OPTIMIZATION OF ACTIVATED CARBON COATED HEAT SINKS

Abstract

With the enhancements in nanotechnology, electronic devices shrank in size which led to a necessity to develop efficient thermal management strategies. These small electronic devices could be thermally managed through passive systems provided that effective materials are developed. Here, we use a layer of activated carbon on top of anodized aluminum heat sinks to utilize the sorption cycle of atmospheric water to create a desorption induced evaporative cooling effect. The material properties of the activated carbon lead to enhanced cooling by radiation and desorption, while the geometry of the heat sinks ensure surface area maximization. We develop a numerical simulation platform to determine the optimum geometry and the optimal activated carbon coating mass. Our results show that as the fin diameter and spacing shrink, and as the activated carbon mass increases within the considered range (0-100 mg), effective cooling of the chip could be achieved. We further employ our simulations to decouple the effects of desorption, radiation, and convection. Our analyses reveal that desorption only plays a vital role during the initial periods of operation, while cooling due to radiation and convection leads to an ≈20% increase in the overall steady-state heat transfer coefficient. This study goes beyond introducing a passive thermal management strategy for small electronic chips by providing a link between mass diffusion and thermal processes for effective transient operation of thermal devices.

Keywords

Thermal management, Activated carbon, Passive device, Heat sink.

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