Ticari ve Askerî Elektronik Cihazlarda Kullanılan Yüzeye Montajlı Yeni Nesil Devre Elemanlarının Tamir Sürecindeki Etkili Faktörler

Yıl 2020, Sayı: 38, 211 - 243, 02.11.2020

Necdet Geren Murat Çakırca

Öz

Son yıllarda elektrikli araçlar, insansız hava araçları, haberleşme uydusu gibi uzay ve havacılık sistemlerinin millî kaynaklar ile geliştirilme çalışmaları artmıştır. Bu nedenle de savunma sanayi ürünlerinin imalat teknolojilerine giderek artan ölçüde ihtiyaç duyulmaktadır. Baskı devre kartı (BDK) tamirini sağlayan tekrar üretim (remanufacturing) olarak da adlandırılan tamir teknolojisi de bu teknolojilerden biridir. BDK tamiri, üretim esnasında veya kullanım sırasında hatası veya arızası tespit edilen elektronik ekipmanın genel performansını ve güvenilirliğini olumsuz yönde etkilemeden hataya neden olan elektronik elemanın ekonomik bir şekilde yenisi ile değiştirilmesini hedefler. Tamirin sağlıklı bir şekilde yapılması, ürünün yaşam döngüsü içindeki güvenilirliğini doğrudan etkiler. Tamir sürecindeki eksik ve hatalı uygulamalar kullanım sırasında arızalara neden olur. Bu da hayati tehlike veya istenmeyen sonuçlar yaratabilir. Elektronik tamir, elektronik üretimin özel ihtisas konusu olarak literatürde yerini almıştır. Ancak konu ile ilgili ulusal bilgi birikimi yetersizdir.
Bu çalışmanın amacı montajlı kart (MK) üzerinde yer alan ızgara dizinimli dâhil yeni nesil yüzeye monte (YM) elektronik devre elemanı (EDE) tamir sürecini, sürecin önemli evrelerini ve süreçteki etkili faktörleri ortaya koymaktır. Çalışmanın içeriği elektronik sistemlerde YM EDE teknoloji kullanan savunma sanayi kuruluşlarının MK tamir süreçlerinin yapılandırılmasına katkı sağlayacaktır. Ayrıca, çalışmanın çıktıları otonom MK tamir sistemlerinin geliştirilebilmesi için gerekli olan temel girdiler olup ürün-makine ilişkisi kurulmasında kullanılabilir.

Anahtar Kelimeler

Savunma Teknolojileri, Elektronik Devre Elemanları Tamiri, Yüzeye Montajlı Yeni Nesil Elektronik Devre Elemanları, Baskı Devre Kartı Tamiri, Izgara Dizinimli (BGA, CSP) Devre Elemanları

Factors Effecting Rework of New Generation Surface Mount Components Used in Commercial and Military Electronic Devices

Öz

In recent years, there has been an increasing amount of efforts to develop space and aviation systems such as electric vehicles, unmanned aerial vehicles, communication satellites through national resources in Turkey. Therefore, an increasing need for manufacturing technologies of defence products has emerged. Printed circuit board assembly (PCBA) and PCBA-rework or “remanufacturing” is one of these technologies. PCBA rework technology aims to replace a defected component economically in electronic equipment without adversely affecting the overall performance, function and reliability of PCBAs. Successful rework plays a major role for product reliability and durability. Incomplete and faulty applications during the repair process may completely disable the products, causing the loss of national resources. In the case of defence products, it can create life-threatening consequences.
Electronic repair is part of electronic production. However, the literature searches reveal that national knowledge on the subject is insufficient. This study reveals the new generation surface mount (SM) electronic component (EC) repair process and the important stages of this process. The content of the study will contribute to the structuring of PCB repair processes of companies using SM technology package. In addition, the fundamental knowledge required to establish the product-machine relationship for a development of autonomous PCB repair systems is provided to the national industry.

Anahtar Kelimeler

Defence Technologies, Electronic Component Repair, New Generation Surface Mounted Electronic Component Repair, Printed Circuit Board Rework, Area Array Components

Kaynakça

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