Öz
Advancements in materials science and technologies enable us to produce more durable, stronger materials of high quality. Developments in thin film technologies play an important role in achieving such an advancement. Thin films are commonly used in research, technological applications, and various industrial activities. In this work, essential thin film production techniques were investigated; the advantages and disadvantages of each essential technique were discussed, and potential industrial and technological applications were mentioned.
Anahtar Kelimeler
Thin Films Physical Vapour Deposition Chemical Vapour Deposition DC Sputtering Electrodeposition
Kaynakça
- W. F. Smith (1986), Principles of Materials Science and Engineering, McGraw Hill Book Co., New York.
- A. Goswami, Thin Film Fundamentals (New Age International, New Delhi, n.d.).
- L. Vossen J and W. Kern (1991), Thin Film Processes II , 1st ed., Academic Press, San Diego.
- S. Zhang and D. Zhao (2013), Aerospace Materials Handbook , 1st ed., CRC Press, Florida.
- P. Louda, J. Achiev. Mater. 24, 50 (2007).
- N. Aslan, M. Ş. Kurt, and M. Mehmet Koç (2022), Opt. Mater. (Amst). 126, 112229.
- F. Yakuphanoglu and W. A. Farooq (2011), Synth. Met. 161, 379.
- N. Aslan, B. Aksakal, B. Dikici, and Z. A. Sinirlioglu (2022), J. Mater. Sci. 57, 16858.
- J. I. Ahuir-Torres (2023), J. Mater. Electron. DEVICES 1, 33.
- J. I. Ahuir-Torres and M. C. Sharp (2022), Lasers Manuf. Mater. Process. 9, 454.
- N. Yamamoto, H. Makino, T. Yamada, Y. Hirashima, H. Iwaoka, T. Ito, A. Ujihara, H. Hokari, H. Morita, and T. Yamamoto (2010), J. Electrochem. Soc. 157, J13.
- S. Niyomsoan, W. Grant, D. L. Olson, and B. Mishra (2002), Thin Solid Films 415, 187.
- H. Frey (2015) in Handb. Thin-Film Technol., Springer Berlin Heidelberg, Berlin, Heidelberg, pp. 1–3.
- L. Smardz, U. Köbler, and W. Zinn (1991), Vacuum 42, 283.
- C. Shi, Z. Chen, G. Shi, R. Sun, X. Zhan, and X. Shen, (2012), Thin Solid Films 520, 4898.
- K. Reichelt and X. Jiang, (1990), Thin Solid Films 191, 91.
- J. A. Greer (2013), J. Phys. D. Appl. Phys. 47, 034005.
- J. Vyskočil and J. Musil (1990), Surf. Coatings Technol. 43–44, 299.
- G. Bräuer, B. Szyszka, M. Vergöhl, and R. Bandorf (2010), Vacuum 84, 1354.
- T. K. Subramanyam, B. Srinivasulu Naidu, and S. Uthanna (2001), Appl. Surf. Sci. 169–170, 529.
- J. O. Carlsson and P. M. Martin (2010), in Handb. Depos. Technol. Film. Coatings Sci. Appl. Technol., William Andrew Publishing, pp. 314–363.
- D. H. Chen and X. R. He (2011), Mater. Res. Bull. 36, 1369.
- R. G. Larson and T. J. Rehg (1997), in Liq. Film Coat., Springer, Dordrecht, pp. 709–734.
- G. Oskam, J. G. Long, A. Natarajan, and P. C. Searson, J.(1998), Phys. D. Appl. Phys. 31, 1927.
Öz
Malzeme bilimi ve teknolojilerinin gelişmesi daha kaliteli, sağlam ve dayanıklı malzemelerin üretilmesine imkân sağlamıştır. Bu gelişmelerin temelinde ince filmlerin yaygın olarak kullanılması ve ince film üretim teknolojilerinin gelişmesi etkili olmuştur. İnce film üretim teknikleri akademik araştırmalarda, teknolojik uygulamalarda ve birçok endüstriyel faaliyette yaygın olarak kullanılmaktadır. Hazırladığımız çalışmamızda temel ince film üretim teknikleri incelenmiş, ince film üretiminde kullanılan her bir temel tekniğin sahip olduğu avantajlar ve dezavantajlar tartışılmış ve ince filmlerin potansiyel uygulama alanlarına değinilmiştir.
Anahtar Kelimeler
İnce Filmler Fiziksel Buhar Kaplama Kimyasal Buhar Kaplama ; DC sıçratma Elektrodepozisyon
Kaynakça
- W. F. Smith (1986), Principles of Materials Science and Engineering, McGraw Hill Book Co., New York.
- A. Goswami, Thin Film Fundamentals (New Age International, New Delhi, n.d.).
- L. Vossen J and W. Kern (1991), Thin Film Processes II , 1st ed., Academic Press, San Diego.
- S. Zhang and D. Zhao (2013), Aerospace Materials Handbook , 1st ed., CRC Press, Florida.
- P. Louda, J. Achiev. Mater. 24, 50 (2007).
- N. Aslan, M. Ş. Kurt, and M. Mehmet Koç (2022), Opt. Mater. (Amst). 126, 112229.
- F. Yakuphanoglu and W. A. Farooq (2011), Synth. Met. 161, 379.
- N. Aslan, B. Aksakal, B. Dikici, and Z. A. Sinirlioglu (2022), J. Mater. Sci. 57, 16858.
- J. I. Ahuir-Torres (2023), J. Mater. Electron. DEVICES 1, 33.
- J. I. Ahuir-Torres and M. C. Sharp (2022), Lasers Manuf. Mater. Process. 9, 454.
- N. Yamamoto, H. Makino, T. Yamada, Y. Hirashima, H. Iwaoka, T. Ito, A. Ujihara, H. Hokari, H. Morita, and T. Yamamoto (2010), J. Electrochem. Soc. 157, J13.
- S. Niyomsoan, W. Grant, D. L. Olson, and B. Mishra (2002), Thin Solid Films 415, 187.
- H. Frey (2015) in Handb. Thin-Film Technol., Springer Berlin Heidelberg, Berlin, Heidelberg, pp. 1–3.
- L. Smardz, U. Köbler, and W. Zinn (1991), Vacuum 42, 283.
- C. Shi, Z. Chen, G. Shi, R. Sun, X. Zhan, and X. Shen, (2012), Thin Solid Films 520, 4898.
- K. Reichelt and X. Jiang, (1990), Thin Solid Films 191, 91.
- J. A. Greer (2013), J. Phys. D. Appl. Phys. 47, 034005.
- J. Vyskočil and J. Musil (1990), Surf. Coatings Technol. 43–44, 299.
- G. Bräuer, B. Szyszka, M. Vergöhl, and R. Bandorf (2010), Vacuum 84, 1354.
- T. K. Subramanyam, B. Srinivasulu Naidu, and S. Uthanna (2001), Appl. Surf. Sci. 169–170, 529.
- J. O. Carlsson and P. M. Martin (2010), in Handb. Depos. Technol. Film. Coatings Sci. Appl. Technol., William Andrew Publishing, pp. 314–363.
- D. H. Chen and X. R. He (2011), Mater. Res. Bull. 36, 1369.
- R. G. Larson and T. J. Rehg (1997), in Liq. Film Coat., Springer, Dordrecht, pp. 709–734.
- G. Oskam, J. G. Long, A. Natarajan, and P. C. Searson, J.(1998), Phys. D. Appl. Phys. 31, 1927.
Ayrıntılar
| Birincil Dil | Türkçe |
|---|---|
| Konular | Mühendislik |
| Bölüm | Sayı |
| Yazarlar | |
| Yayımlanma Tarihi | 30 Haziran 2023 |
| Yayımlandığı Sayı | Yıl 2023 |