Araştırma Makalesi
BibTex RIS Kaynak Göster
Yıl 2023, Cilt: 6 Sayı: 2, 46 - 49, 31.12.2023

Öz

Kaynakça

  • Standard Classification of Coppers, ASTM B224, ASTM International. USA, 2022
  • Standard Specification for Copper Rod for Electrical Purposes, ASTM B49, ASTM International, USA, 2020
  • Standard Specification for General Requirements for Wrought Copper Alloy Wire, ASTM B250, ASTM International, USA, 2019 Standard Specification for Copper Flat Products with Finished (Rolled or Drawn) Edges (Flat Wire and Strip), ASTM B272, ASTM International, USA, 2019
  • Standard Specification for Tough-Pitch Fire-Refined Copper, Refinery Shapes, ASTM B 216, ASTM International, USA, 2022
  • Rudolf S, SMT Soldering Handbook, 2nd Edition, ISBN: 0-7506-35894, Newnes, Butterworth Heinemann, Elsevier, 1998: 20-60
  • ASM Handbook Committee, Welding Brazing and Soldering, ASM Metals Handbook Volume 6, Electronic Version, ISBN: 0-87170-382-3 USA, 1993: 270, 453-480,
  • Standard practice for preparing cleaning and evaluation for corrosion test specimens, ASTM G1, ASTM International, USA, 2017
  • Soft solder alloys-chemical compositions and forms, ISO 9453, International Standards Organization, 2020
  • Soft soldering fluxes, classification and requirements, Part one, classification, labeling and packaging, ISO 9454-1, International Standards Organization, 2016
  • Nazeri, F.H.M., et.al., Corrosion characterization of Sn-Zn solder, A Review, Soldering and Surface Mount Technology, 2019, 31(1): 52-67
  • Asri, A.K., and Hamzah, E., Corrosion behavior of lead free and Sn-Pb solders in 3.5wt% NaCl, Green Technologies for Sustainable and Innovation in Materials, 2013, 686: 250-260
  • Hu, J, et.al., Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution, Journal of Electronic Materials, 2011, 40(7):1556-1562
  • Grobelny, M., Sobczak, N., Corrosion processes of lead-free solders Sn-Zn type, Ochrona Przed Korozja, 2012, 55(11):488-490
  • Ning, X., et.al., Effect of some N-heterocyclic inhibitors in the soldering flux on the corrosion behavior of eutectic Sn-58Bi alloy and its solder paste, 19th International Conference on Electronic Packaging Technology, Shangai, China, 2018
  • Dan, H., Jian, Z., Pei L.P., Corrosion Performance of Pb-free Sn-Zn Solders in Salt Spray, International Conference on Electronic Packaging Technology and High Density Packaging, Proceeding Paper. Shangai, China, 2008, 2: 713-716
  • Yang, F., Wang, L.H., Li, X.G., Zhao, J., Comparison of corrosion behavior of soldering alloys and joints, Transferability and Applicability of Current Mechanics Approaches, 7th Fracture Mechanics Symposium, Chengdu, China, Proceedings Paper, 2009:501-506

THE EFFECTS OF SOLDERING FLUX TYPE ON CORROSION PROPERTIES OF ELECTRICAL WIRES

Yıl 2023, Cilt: 6 Sayı: 2, 46 - 49, 31.12.2023

Öz

Abstract

Electrical wires are used in many applications with increasing amounts especially in constructions and houses. These conductive wires are mainly manufactured from 99.9% (by weight) electrolytic copper with restricted amounts of other minor elements. Copper wires are joined by soldering operations in aim of high electrical conducting efficiency. Soldering flux usage is a must in soldering where higher corrosion resistance with satisfactory adhesion property is in concern for increasing joining quality. Soldering flux exhibits an important role related with adhesion and corrosion properties of the joints.

In this study, three different types of soldering fluxes were used in soldering of electrical copper wire. Corrosion test is applied on soldered wires with also unsoldered raw copper wire by immersing in 20%NaOH solution by 96 hours of duration time. Comparison of corrosion resistance of samples is investigated by weight loss principle according to ASTM G1 standard document. The highest corrosion resistance was observed on samples joined with a solder flux of having zinc and ammonium chloride while the least corrosion resistance was observed in samples joined with flux containing halides.

Kaynakça

  • Standard Classification of Coppers, ASTM B224, ASTM International. USA, 2022
  • Standard Specification for Copper Rod for Electrical Purposes, ASTM B49, ASTM International, USA, 2020
  • Standard Specification for General Requirements for Wrought Copper Alloy Wire, ASTM B250, ASTM International, USA, 2019 Standard Specification for Copper Flat Products with Finished (Rolled or Drawn) Edges (Flat Wire and Strip), ASTM B272, ASTM International, USA, 2019
  • Standard Specification for Tough-Pitch Fire-Refined Copper, Refinery Shapes, ASTM B 216, ASTM International, USA, 2022
  • Rudolf S, SMT Soldering Handbook, 2nd Edition, ISBN: 0-7506-35894, Newnes, Butterworth Heinemann, Elsevier, 1998: 20-60
  • ASM Handbook Committee, Welding Brazing and Soldering, ASM Metals Handbook Volume 6, Electronic Version, ISBN: 0-87170-382-3 USA, 1993: 270, 453-480,
  • Standard practice for preparing cleaning and evaluation for corrosion test specimens, ASTM G1, ASTM International, USA, 2017
  • Soft solder alloys-chemical compositions and forms, ISO 9453, International Standards Organization, 2020
  • Soft soldering fluxes, classification and requirements, Part one, classification, labeling and packaging, ISO 9454-1, International Standards Organization, 2016
  • Nazeri, F.H.M., et.al., Corrosion characterization of Sn-Zn solder, A Review, Soldering and Surface Mount Technology, 2019, 31(1): 52-67
  • Asri, A.K., and Hamzah, E., Corrosion behavior of lead free and Sn-Pb solders in 3.5wt% NaCl, Green Technologies for Sustainable and Innovation in Materials, 2013, 686: 250-260
  • Hu, J, et.al., Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution, Journal of Electronic Materials, 2011, 40(7):1556-1562
  • Grobelny, M., Sobczak, N., Corrosion processes of lead-free solders Sn-Zn type, Ochrona Przed Korozja, 2012, 55(11):488-490
  • Ning, X., et.al., Effect of some N-heterocyclic inhibitors in the soldering flux on the corrosion behavior of eutectic Sn-58Bi alloy and its solder paste, 19th International Conference on Electronic Packaging Technology, Shangai, China, 2018
  • Dan, H., Jian, Z., Pei L.P., Corrosion Performance of Pb-free Sn-Zn Solders in Salt Spray, International Conference on Electronic Packaging Technology and High Density Packaging, Proceeding Paper. Shangai, China, 2008, 2: 713-716
  • Yang, F., Wang, L.H., Li, X.G., Zhao, J., Comparison of corrosion behavior of soldering alloys and joints, Transferability and Applicability of Current Mechanics Approaches, 7th Fracture Mechanics Symposium, Chengdu, China, Proceedings Paper, 2009:501-506
Toplam 16 adet kaynakça vardır.

Ayrıntılar

Birincil Dil İngilizce
Konular Malzeme Üretim Teknolojileri
Bölüm Articles
Yazarlar

Aziz Barış Başyiğit 0000-0003-1544-3747

Murat Serdar Ilıcan 0009-0007-6213-2999

Erken Görünüm Tarihi 30 Aralık 2023
Yayımlanma Tarihi 31 Aralık 2023
Kabul Tarihi 17 Ağustos 2023
Yayımlandığı Sayı Yıl 2023 Cilt: 6 Sayı: 2

Kaynak Göster

APA Başyiğit, A. B., & Ilıcan, M. S. (2023). THE EFFECTS OF SOLDERING FLUX TYPE ON CORROSION PROPERTIES OF ELECTRICAL WIRES. The International Journal of Materials and Engineering Technology, 6(2), 46-49.