Research Article

Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications

Volume: 10 Number: 3 September 30, 2025
TR EN

Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications

Abstract

The increasing number of wearable wireless communication and biomedical applications have led to need for conformal electronic to significantly enhance health and wellness monitoring of users and performance of improve interaction human-machine interfaces. This paper describes numerical characterization conformal and light-weight Radio Frequency (RF) interconnects with ground defected split ring resonator based upon polymer composites Polydimethylsiloxane, namely PDMS, is used. The impact of conformal bending on the electromagnetic performance of the RF interconnects was considered and analyzed both in frequency domain Finite Element Modelling method, (FEM). The merits of electromagnetic performance reflection coefficients, in conjunction with accuracy, and versatility are discussed, and results are compared. Simulated model the designed stretchable high-frequency microstrip interconnects has a maximum magnitude, S11 of -15 dB and a minimum magnitude of reflection coefficient, S21 of –0.62 dB . The Split Ring Resonator (SRR) exhibits resonance within the sub-millimeter 5G frequency band, achieving a resonant frequency at 3.456 GHz with a peak reflection coefficient (S₁₁) of –24.45 dB, indicating strong resonance and efficient energy coupling. The presented microstrip transmission line is a useful example for feeding network of wearable microstrip sensors and in applications where inevitable mechanical flexibility helps improve reliability and durability of RF sensing systems.

Keywords

References

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Details

Primary Language

English

Subjects

Circuits and Systems, Engineering Electromagnetics

Journal Section

Research Article

Early Pub Date

September 29, 2025

Publication Date

September 30, 2025

Submission Date

July 14, 2025

Acceptance Date

July 21, 2025

Published in Issue

Year 2025 Volume: 10 Number: 3

APA
Altınözen, E. (2025). Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications. Harran Üniversitesi Mühendislik Dergisi, 10(3), 172-183. https://doi.org/10.46578/humder.1741743
AMA
1.Altınözen E. Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications. Harran Üniversitesi Mühendislik Dergisi. 2025;10(3):172-183. doi:10.46578/humder.1741743
Chicago
Altınözen, Ekrem. 2025. “Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications”. Harran Üniversitesi Mühendislik Dergisi 10 (3): 172-83. https://doi.org/10.46578/humder.1741743.
EndNote
Altınözen E (September 1, 2025) Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications. Harran Üniversitesi Mühendislik Dergisi 10 3 172–183.
IEEE
[1]E. Altınözen, “Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications”, Harran Üniversitesi Mühendislik Dergisi, vol. 10, no. 3, pp. 172–183, Sept. 2025, doi: 10.46578/humder.1741743.
ISNAD
Altınözen, Ekrem. “Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications”. Harran Üniversitesi Mühendislik Dergisi 10/3 (September 1, 2025): 172-183. https://doi.org/10.46578/humder.1741743.
JAMA
1.Altınözen E. Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications. Harran Üniversitesi Mühendislik Dergisi. 2025;10:172–183.
MLA
Altınözen, Ekrem. “Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications”. Harran Üniversitesi Mühendislik Dergisi, vol. 10, no. 3, Sept. 2025, pp. 172-83, doi:10.46578/humder.1741743.
Vancouver
1.Ekrem Altınözen. Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications. Harran Üniversitesi Mühendislik Dergisi. 2025 Sep. 1;10(3):172-83. doi:10.46578/humder.1741743

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