Araştırma Makalesi

Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications

Cilt: 10 Sayı: 3 30 Eylül 2025
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Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications

Öz

The increasing number of wearable wireless communication and biomedical applications have led to need for conformal electronic to significantly enhance health and wellness monitoring of users and performance of improve interaction human-machine interfaces. This paper describes numerical characterization conformal and light-weight Radio Frequency (RF) interconnects with ground defected split ring resonator based upon polymer composites Polydimethylsiloxane, namely PDMS, is used. The impact of conformal bending on the electromagnetic performance of the RF interconnects was considered and analyzed both in frequency domain Finite Element Modelling method, (FEM). The merits of electromagnetic performance reflection coefficients, in conjunction with accuracy, and versatility are discussed, and results are compared. Simulated model the designed stretchable high-frequency microstrip interconnects has a maximum magnitude, S11 of -15 dB and a minimum magnitude of reflection coefficient, S21 of –0.62 dB . The Split Ring Resonator (SRR) exhibits resonance within the sub-millimeter 5G frequency band, achieving a resonant frequency at 3.456 GHz with a peak reflection coefficient (S₁₁) of –24.45 dB, indicating strong resonance and efficient energy coupling. The presented microstrip transmission line is a useful example for feeding network of wearable microstrip sensors and in applications where inevitable mechanical flexibility helps improve reliability and durability of RF sensing systems.

Anahtar Kelimeler

Kaynakça

  1. J. Chen et al., "Polydimethylsiloxane (PDMS)-Based Flexible Resistive Strain Sensors for Wearable Applications," Applied Sciences, vol. 8, no. 3, 2018.
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  5. Z. Chen, J. Xi, W. Huang, and M. M. F. Yuen, "Stretchable Conductive Elastomer for Wireless Wearable Communication Applications," Sci Rep, vol. 7, no. 1, p. 10958, Sep 8 2017
  6. S. C. Mukhopadhyay, Wearable electronics sensors: For safe and healthy living. Springer, 2015.
  7. B. Yan, F. Zhang, M. Wang, Y. Zhang, and S. Fu, "Flexible wearable sensors for crop monitoring: a review," Front Plant Sci, vol. 15, p. 1406074, 2024.
  8. A. Mostaccio, G. Antonelli, R. Capuano, C. D. Natale, E. Martinelli, and G. Marrocco, "Full-LIG Wireless Batteryless Flexible Sensor for the Detection of Triethylamine," IEEE Journal on Flexible Electronics, vol. 3, no. 3, pp. 90-99, 2024

Ayrıntılar

Birincil Dil

İngilizce

Konular

Devreler ve Sistemler, Mühendislik Elektromanyetiği

Bölüm

Araştırma Makalesi

Erken Görünüm Tarihi

29 Eylül 2025

Yayımlanma Tarihi

30 Eylül 2025

Gönderilme Tarihi

14 Temmuz 2025

Kabul Tarihi

21 Temmuz 2025

Yayımlandığı Sayı

Yıl 2025 Cilt: 10 Sayı: 3

Kaynak Göster

APA
Altınözen, E. (2025). Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications. Harran Üniversitesi Mühendislik Dergisi, 10(3), 172-183. https://doi.org/10.46578/humder.1741743
AMA
1.Altınözen E. Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications. HUMDER. 2025;10(3):172-183. doi:10.46578/humder.1741743
Chicago
Altınözen, Ekrem. 2025. “Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications”. Harran Üniversitesi Mühendislik Dergisi 10 (3): 172-83. https://doi.org/10.46578/humder.1741743.
EndNote
Altınözen E (01 Eylül 2025) Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications. Harran Üniversitesi Mühendislik Dergisi 10 3 172–183.
IEEE
[1]E. Altınözen, “Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications”, HUMDER, c. 10, sy 3, ss. 172–183, Eyl. 2025, doi: 10.46578/humder.1741743.
ISNAD
Altınözen, Ekrem. “Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications”. Harran Üniversitesi Mühendislik Dergisi 10/3 (01 Eylül 2025): 172-183. https://doi.org/10.46578/humder.1741743.
JAMA
1.Altınözen E. Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications. HUMDER. 2025;10:172–183.
MLA
Altınözen, Ekrem. “Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications”. Harran Üniversitesi Mühendislik Dergisi, c. 10, sy 3, Eylül 2025, ss. 172-83, doi:10.46578/humder.1741743.
Vancouver
1.Ekrem Altınözen. Numerical Analysis of a Flexible Interconnect and Ground-Defected Split Ring Resonator for High-Frequency 5G Sensing Applications. HUMDER. 01 Eylül 2025;10(3):172-83. doi:10.46578/humder.1741743

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