Electrostatic discharge risks in electronics used in automotive application / Otomotiv Uygulamalarında Kullanılan Elektronik Donanımda Elektrostatik Boşalma Riskleri
Abstract
The automotive industry pays special attention to knowledge-based specification, design, manufacturing and qualification of components and other integrated circuits (ICs). As a result, there is the demand for ICs to be fit-for-application rather than any consideration of fit-for-standard. Thus when the ESD specs are stated, the rationale for the requirements needs to be understood. Therefore, we first need to consider if the ESD requirements for the automotive environment are any different from other consumer product environment requirements. Additionally, automotive product markets often demand “Zero PPM (Parts Per Million)” for overall IC product reliability that includes ESD.
Özet: Otomotiv endüstrisi bilgi temelli özelleşmeye, tasarıma, imalata ve donanımların daha becerikli hale getirilmelerine ve diğer entegre devrelere (IC’s) özel dikkat göstermektedir. Bunun bir sonucu olarak, IC’s lerin standarda uygun olmasından ziyade uygulamaya uygun olmasına yönelik bir talep bulunmaktadır. Bu nedenle ESD özellikleri belirlendiğinde, gerekliliklerin arkasındaki mantık anlaşılmalıdır. Dolaysıyla ilk önce otomotiv için ESD gerekliliklerinin diğer tüketici ürünlerinin gerekliliklerinden farklı olup olmadıkları karşılaştırılmalıdır. Ek olarak otomotiv ürünleri pazarları sıklıkla ESD’yi içeren genel IC ürün güvenilirliği için “Sıfır PPM (Milyondaki Parçacık Sayısı)” talep etmektedir.
Keywords
References
- M. P. J. Mergens, M. T. Mayerhofer, J. A. Willemen, and M. Stecher, “ESD protection considerations in advanced high- voltage technologies for automotive,” in Proc. EOS/ESD Symp., 2006, pp. 54–63.
- R.G. Wagner, J. Soden, C.F. Hawkins, “Extent and Cost of EOS/ESD Damage In an Proceedings
- Symposium, pp. 49–55
- D.L. Lin, “ESD Sensitivity and VLSI Technology Trends: Thermal Breakdown and Dielectric Breakdown”, in Proceedings of the 15th EOS/ESD Symposium, pp. 73–82 [4] N. Tandan, G. Conner, “ESD Trigger Circuit”, in Proceedings of the 16th EOS/ESD Symposium, pp. 120–124
- C. Duvvury, R. Rountree and O. Adams, “Internal chip ESD phenomena beyond the protection circuit”, in IEEE T. Electron Dev., ED-35, 2133–2139
- T.J. Maloney and S. Dabral, “Novel Clamp Circuits for IC Power Supply Protection”, in Proc. 17th EOS/ESD Symposium, pp. 1–12
- J. A. Salcedo and J. J. Liou, “A novel dual-polarity device with symmetrical/ asymmetrical S-type I−V characteristics for ESD protection design”,pp.65–67,Jan. 2006. [8]
- Compatibility (EMC) – Part 4: Testing and Measurement Techniques [9] Compatibility (EMC) Process”, in of the 15th
- EOS/ESD IEC 61000-4-2,
- “Electromagnetic IEC 61000-4-4, “Electromagnetic
Abstract
References
- M. P. J. Mergens, M. T. Mayerhofer, J. A. Willemen, and M. Stecher, “ESD protection considerations in advanced high- voltage technologies for automotive,” in Proc. EOS/ESD Symp., 2006, pp. 54–63.
- R.G. Wagner, J. Soden, C.F. Hawkins, “Extent and Cost of EOS/ESD Damage In an Proceedings
- Symposium, pp. 49–55
- D.L. Lin, “ESD Sensitivity and VLSI Technology Trends: Thermal Breakdown and Dielectric Breakdown”, in Proceedings of the 15th EOS/ESD Symposium, pp. 73–82 [4] N. Tandan, G. Conner, “ESD Trigger Circuit”, in Proceedings of the 16th EOS/ESD Symposium, pp. 120–124
- C. Duvvury, R. Rountree and O. Adams, “Internal chip ESD phenomena beyond the protection circuit”, in IEEE T. Electron Dev., ED-35, 2133–2139
- T.J. Maloney and S. Dabral, “Novel Clamp Circuits for IC Power Supply Protection”, in Proc. 17th EOS/ESD Symposium, pp. 1–12
- J. A. Salcedo and J. J. Liou, “A novel dual-polarity device with symmetrical/ asymmetrical S-type I−V characteristics for ESD protection design”,pp.65–67,Jan. 2006. [8]
- Compatibility (EMC) – Part 4: Testing and Measurement Techniques [9] Compatibility (EMC) Process”, in of the 15th
- EOS/ESD IEC 61000-4-2,
- “Electromagnetic IEC 61000-4-4, “Electromagnetic
Details
| Primary Language | English |
|---|---|
| Journal Section | Technical Note |
| Authors | |
| Publication Date | April 3, 2014 |
| Submission Date | July 31, 2013 |
| Published in Issue | Year 2014 Volume: 3 Issue: 1 |