Research Article
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Year 2019, Volume: 3 Issue: 4, 158 - 167, 31.12.2019
https://doi.org/10.30521/jes.616982

Abstract

References

  • Black, J. R. Electromigration—A brief survey and some recent results. IEEE Transactions on Electron Devices 1969, 16, 338-347. DOI: 10.1109/T-ED.1969.16754
  • Ho, P. S. and Kwok, T. Electromigration in metals. Reports on Progress in Physics 1989, 52, 301-348. DOI: 10.1088/0034-4885/52/3/002
  • Lienig, J, Thiele, M. Fundamentals of Electromigration-Aware Integrated Circuit Design. Fundamentals of Electromigration, Springer International Publishing, Switzerland, 2018.
  • Canumalla, S, Viswanadham, P. Portable Consumer Electronics: Packaging, Materials, and Reliability. Second level packaging–interconnect technologies, PennWell Corporation, Oklahoma, USA, 2010.
  • Celnikier, Y, Benabou, L, Dupont, L, Coquery, G. Investigation of the heel crack mechanism in Al connections for power electronics modules. Microelectronics reliability 2011, 51, 965-974. DOI: 10.1016/j.microrel.2011.01.001
  • Poech, M. H. How materials behaviour affects power electronics reliability. In: 6th International Conference on Integrated Power Electronics Systems, 16-18 March 2010, IEEE, Nuremberg, Germany: pp. 1-6.
  • Teng, H, Zhang, H, Yang, H, Zhou, M, Tsui, A. C. Effect of moisture and temperature on Al-Cu interfacial strength. In: International Conference on Electronic Packaging Technology & High Density Packaging, 28-31 July 2008, IEEE, Shanghai, China: pp. 1-4.
  • Onuki, J, Koizumi, M, Araki, I. Investigation of the Reliability of Copper Ball Bonds to Aluminum Electrodes. IEEE Transactions on components, hybrids, and manufacturing technology 1987, 10, 550-555. DOI: 10.1109/TCHMT.1987.1134799
  • Tian, Y, Hang, C, Wang, C, Zhou, Y. Evolution of Cu/Al Intermetallic Compounds in the Copper Bump bonds during Aging Process. In: 8th International Conference on Electronic Packaging Technology, 14-17 Aug. 2007, IEEE, Shanghai, China: pp. 1-5.
  • Bashir, M. N., Haseeb, A.S.M.A., Rahman, A.Z.M.S., et al. Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping. Journal of Materials Science 2015, 50, pp. 6748-6756. DOI: https://doi.org/10.1007/s10853-015-9230-7
  • Smeby, J. Solder Joint Behavior in HCC/PWB Interconnections. IEEE Transactions on Components, Hybrids, and Manufacturing Technology 1985, 8, 391-396. DOI: 10.1109/TCHMT.1985.1136512
  • Takahashi, T, Yu, Q. Precision evaluation for thermal fatigue life of power module using coupled electrical-thermal-mechanical analysis. In: 12th Electronics Packaging Technology Conference, 8-10 Dec. 2010, IEEE, Singapore, Singapore: pp. 201-205.
  • Anzawa, T, Yu, Q, Yamagiwa, M, Shibutani, T, Shiratori, M. Power cycle fatigue reliability evaluation for power device using coupled electrical-thermal-mechanical analysis. In: 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 28-31 May 2008, IEEE, Orlando, Florida, USA: pp. 815-821.
  • Anzawa, T, Yu, Q, Shibutani, T, Shiratori, M. Reliability Evaluation for Power Electronics Device using Electrical Thermal and Mechanical Analysis. In: 9th Electronics Packaging Technology Conference, 10-12 Dec. 2007, IEEE, Singapore, Singapore: pp. 94-99.
  • Yang, L, Agyakwa, P. A, Johnson, and C. M. Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules. IEEE Transactions on Device and Materials Reliability 2013, 13, 9-17. DOI: 10.1109/TDMR.2012.2235836
  • Zhang, X, Selvanayagam, C. S, Yong, W. Y, Chai, T. C, Trigg, A. D. Design and development of micro-sensors for measuring localised stresses during copper wirebonding. In: 14th Electronics Packaging Technology Conference (EPTC), 5-7 Dec. 2012, IEEE, Singapore, Singapore: pp. 244-250.
  • Hamidi A, Team, P.P. Introduction to semiconductor packaging in high power electronics. Seminaire ECPE, May 2004.
  • Blaauw, D. T., Chanhee Oh, Zolotov, V, Dasgupta, A. Static electromigration analysis for on-chip signal interconnects. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2003, 22, 39-48. DOI: 10.1109/TCAD.2002.805728
  • Trikoupis, N, Casas, J, Fontenla, A.T.P. Electromigration driven failures on miniature silver fuses at the Large Hadron Collider. In: Proceedings of Science of Topical Workshop on Electronics for Particle Physics (TWEPP-17), 11-15 Sep. 2017, Santa Cruz, California, USA: pp. 066.
  • Trouwborst, M.L, Molen, S.J, Wees, B.J. The role of Joule heating in the formation of nanogaps by electromigration. Journal of Applied Physics 2006, 99, 1-9. DOI: 10.1063/1.2203410
  • Dwyer, V.M. Modeling the electromigration failure time distribution in short copper interconnects. Journal of Applied Physics 2008, 104, 1-12. DOI: 10.1063/1.2970171
  • Doyen, L, Federspiel, X, Arnaud, L, Terrier, F, Wouters, Y, Girault, V. Electromigration multistress pattern technique for copper drift velocity and Black’s parameters extraction. In: International Integrated Reliability Workshop Final Report, 15-18 Oct. 2007, IEEE, S. Lake Tahoe, Canada, USA: pp. 74-78.
  • Tan C.M., He F., Electromigration Modeling at Circuit Layout Level. Springer Briefs in Applied Sciences and Technology. Springer, Singapore, 2013.
  • Gambino J., Process technology for copper interconnects. Handbook of Thin Film Deposition. Techniques, Processes, and Technologies (3rd Edition), William Andrew Publishing, Waltham, USA, 2012.
  • Chatterjee, S, Sukharev, V, Najm, F. N. Power Grid Electromigration Checking Using Physics-Based Models. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2018, 37, 1317-1330. DOI: 10.1109/TCAD.2017.2666723
  • Jain, P, Mishra, V, Sapatnekar, S. S. Fast Stochastic Analysis of Electromigration in Power Distribution Networks. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 2017, 25, 2512-2524. DOI: 10.1109/TVLSI.2017.2706520
  • Calixto, E. Accelerated life test, reliability growth analysis, and probabilistic degradation analysis. Gas and Oil Reliability Engineering: Modeling and Analysis (2nd Edition). Gulf Professional Publishing, Texas, USA, 2016.
  • Meyer, M. A. Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects, PhD, Brandenburg University of Technology Cottbus–Senftenberg, Germany, 2007.
  • Lienig, J. Interconnect and current density stress - an introduction to electromigration-aware design. In : Proceedings of the SLIP ‘05 International workshop on System level interconnect prediction, 2-3 April 2005, San Francisco, California, USA : pp. 81-88.

Experimental realization of electromigration at high power for copper wires

Year 2019, Volume: 3 Issue: 4, 158 - 167, 31.12.2019
https://doi.org/10.30521/jes.616982

Abstract

The electromigration
phenomenon is a topical concern in all types of interconnects in power systems
for both low and high voltages, low and large power ranges, for instance, in
fabrication and manufacturing of Integrated Circuits, electronics of the power
modules, power grid interconnects etc. Due to distributed generation units, in
particular, renewable energy sources, which are commonly connected to already
existing infrastructures, the considered issues related to the electromigration
impact will result to a potential reduction of the electrical interconnection
failure risks. Thus, the design of the integrated systems has to perform at
highly efficient level with low probability of disconnections. The presented
study considers the effect of the electromigration in terms of the spatial
direction of the currents by observing directions of the sparks under certain
arrangements of copper wires’ connections. The experimental setup has been
developed in order to realize and observe the theoretical expectations. The
experimental results were conducted at around 500 A, and the corresponding
observations match theoretical expectations.

References

  • Black, J. R. Electromigration—A brief survey and some recent results. IEEE Transactions on Electron Devices 1969, 16, 338-347. DOI: 10.1109/T-ED.1969.16754
  • Ho, P. S. and Kwok, T. Electromigration in metals. Reports on Progress in Physics 1989, 52, 301-348. DOI: 10.1088/0034-4885/52/3/002
  • Lienig, J, Thiele, M. Fundamentals of Electromigration-Aware Integrated Circuit Design. Fundamentals of Electromigration, Springer International Publishing, Switzerland, 2018.
  • Canumalla, S, Viswanadham, P. Portable Consumer Electronics: Packaging, Materials, and Reliability. Second level packaging–interconnect technologies, PennWell Corporation, Oklahoma, USA, 2010.
  • Celnikier, Y, Benabou, L, Dupont, L, Coquery, G. Investigation of the heel crack mechanism in Al connections for power electronics modules. Microelectronics reliability 2011, 51, 965-974. DOI: 10.1016/j.microrel.2011.01.001
  • Poech, M. H. How materials behaviour affects power electronics reliability. In: 6th International Conference on Integrated Power Electronics Systems, 16-18 March 2010, IEEE, Nuremberg, Germany: pp. 1-6.
  • Teng, H, Zhang, H, Yang, H, Zhou, M, Tsui, A. C. Effect of moisture and temperature on Al-Cu interfacial strength. In: International Conference on Electronic Packaging Technology & High Density Packaging, 28-31 July 2008, IEEE, Shanghai, China: pp. 1-4.
  • Onuki, J, Koizumi, M, Araki, I. Investigation of the Reliability of Copper Ball Bonds to Aluminum Electrodes. IEEE Transactions on components, hybrids, and manufacturing technology 1987, 10, 550-555. DOI: 10.1109/TCHMT.1987.1134799
  • Tian, Y, Hang, C, Wang, C, Zhou, Y. Evolution of Cu/Al Intermetallic Compounds in the Copper Bump bonds during Aging Process. In: 8th International Conference on Electronic Packaging Technology, 14-17 Aug. 2007, IEEE, Shanghai, China: pp. 1-5.
  • Bashir, M. N., Haseeb, A.S.M.A., Rahman, A.Z.M.S., et al. Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping. Journal of Materials Science 2015, 50, pp. 6748-6756. DOI: https://doi.org/10.1007/s10853-015-9230-7
  • Smeby, J. Solder Joint Behavior in HCC/PWB Interconnections. IEEE Transactions on Components, Hybrids, and Manufacturing Technology 1985, 8, 391-396. DOI: 10.1109/TCHMT.1985.1136512
  • Takahashi, T, Yu, Q. Precision evaluation for thermal fatigue life of power module using coupled electrical-thermal-mechanical analysis. In: 12th Electronics Packaging Technology Conference, 8-10 Dec. 2010, IEEE, Singapore, Singapore: pp. 201-205.
  • Anzawa, T, Yu, Q, Yamagiwa, M, Shibutani, T, Shiratori, M. Power cycle fatigue reliability evaluation for power device using coupled electrical-thermal-mechanical analysis. In: 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 28-31 May 2008, IEEE, Orlando, Florida, USA: pp. 815-821.
  • Anzawa, T, Yu, Q, Shibutani, T, Shiratori, M. Reliability Evaluation for Power Electronics Device using Electrical Thermal and Mechanical Analysis. In: 9th Electronics Packaging Technology Conference, 10-12 Dec. 2007, IEEE, Singapore, Singapore: pp. 94-99.
  • Yang, L, Agyakwa, P. A, Johnson, and C. M. Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules. IEEE Transactions on Device and Materials Reliability 2013, 13, 9-17. DOI: 10.1109/TDMR.2012.2235836
  • Zhang, X, Selvanayagam, C. S, Yong, W. Y, Chai, T. C, Trigg, A. D. Design and development of micro-sensors for measuring localised stresses during copper wirebonding. In: 14th Electronics Packaging Technology Conference (EPTC), 5-7 Dec. 2012, IEEE, Singapore, Singapore: pp. 244-250.
  • Hamidi A, Team, P.P. Introduction to semiconductor packaging in high power electronics. Seminaire ECPE, May 2004.
  • Blaauw, D. T., Chanhee Oh, Zolotov, V, Dasgupta, A. Static electromigration analysis for on-chip signal interconnects. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2003, 22, 39-48. DOI: 10.1109/TCAD.2002.805728
  • Trikoupis, N, Casas, J, Fontenla, A.T.P. Electromigration driven failures on miniature silver fuses at the Large Hadron Collider. In: Proceedings of Science of Topical Workshop on Electronics for Particle Physics (TWEPP-17), 11-15 Sep. 2017, Santa Cruz, California, USA: pp. 066.
  • Trouwborst, M.L, Molen, S.J, Wees, B.J. The role of Joule heating in the formation of nanogaps by electromigration. Journal of Applied Physics 2006, 99, 1-9. DOI: 10.1063/1.2203410
  • Dwyer, V.M. Modeling the electromigration failure time distribution in short copper interconnects. Journal of Applied Physics 2008, 104, 1-12. DOI: 10.1063/1.2970171
  • Doyen, L, Federspiel, X, Arnaud, L, Terrier, F, Wouters, Y, Girault, V. Electromigration multistress pattern technique for copper drift velocity and Black’s parameters extraction. In: International Integrated Reliability Workshop Final Report, 15-18 Oct. 2007, IEEE, S. Lake Tahoe, Canada, USA: pp. 74-78.
  • Tan C.M., He F., Electromigration Modeling at Circuit Layout Level. Springer Briefs in Applied Sciences and Technology. Springer, Singapore, 2013.
  • Gambino J., Process technology for copper interconnects. Handbook of Thin Film Deposition. Techniques, Processes, and Technologies (3rd Edition), William Andrew Publishing, Waltham, USA, 2012.
  • Chatterjee, S, Sukharev, V, Najm, F. N. Power Grid Electromigration Checking Using Physics-Based Models. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2018, 37, 1317-1330. DOI: 10.1109/TCAD.2017.2666723
  • Jain, P, Mishra, V, Sapatnekar, S. S. Fast Stochastic Analysis of Electromigration in Power Distribution Networks. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 2017, 25, 2512-2524. DOI: 10.1109/TVLSI.2017.2706520
  • Calixto, E. Accelerated life test, reliability growth analysis, and probabilistic degradation analysis. Gas and Oil Reliability Engineering: Modeling and Analysis (2nd Edition). Gulf Professional Publishing, Texas, USA, 2016.
  • Meyer, M. A. Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects, PhD, Brandenburg University of Technology Cottbus–Senftenberg, Germany, 2007.
  • Lienig, J. Interconnect and current density stress - an introduction to electromigration-aware design. In : Proceedings of the SLIP ‘05 International workshop on System level interconnect prediction, 2-3 April 2005, San Francisco, California, USA : pp. 81-88.
There are 29 citations in total.

Details

Primary Language English
Subjects Electrical Engineering
Journal Section Research Articles
Authors

İbrahim Mahariq 0000-0002-7222-3014

Svetlana Beryozkina This is me 0000-0003-1593-129X

Publication Date December 31, 2019
Acceptance Date December 9, 2019
Published in Issue Year 2019 Volume: 3 Issue: 4

Cite

Vancouver Mahariq İ, Beryozkina S. Experimental realization of electromigration at high power for copper wires. Journal of Energy Systems. 2019;3(4):158-67.

Journal of Energy Systems is the official journal of 

European Conference on Renewable Energy Systems (ECRES8756 and


Electrical and Computer Engineering Research Group (ECERG)  8753


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