Performance Evaluation of Hybrid Sandwich Panels Composed of Recycled Particleboard Cores and MDF Face Materials
Öz
This study investigated the recovery potential and reuse possibilities of waste particleboards. , Waste particleboards were used as sandwich cores through two different methods. In the first method, waste particleboards obtained from different sources were recycled by processing them through a chipping machine. The resulting chips were sieved and classified to ensure homogeneity in terms of size and shape. After the classification, the chips were dried to obtain homogeneous moisture content. The chips were then used in the production of single-layer particleboards bonded with urea-formaldehyde adhesive. The produced single-layer particleboards had a target density of 0.5 g/cm3, a thickness of 10 mm, and an adhesive content of 10 % based on oven dried weight of the dry chip amount. The surfaces of the produced single-layer particleboards were bonded to 4 mm thick MDF boards using PVA adhesive, and sandwich boards were produced by cold pressing. In the second method, used particleboard was cut into 10 mm wide strips and used directly as sandwich panel cores. The face materials and adhesive in this method were the same as those used in the first method. The resulting sandwich materials were conditioned at 65% humidity and 21 °C. Test specimens were cut from the sandwich panels and evaluated for density, thickness swelling, and bending properties. The modulus of elasticity and bending strength values of sandwich panels ranged from 1861 to 2974 N/mm2, and 16.90 to 26.75 N/mm2, respectively. The sandwich panels manufactured using second method yielded thickness swelling values lower than 15%. The results of the study showed that waste particleboard can be successfully reused in sandwich panel production.
Anahtar Kelimeler
Destekleyen Kurum
Etik Beyan
Teşekkür
Kaynakça
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Ayrıntılar
Birincil Dil
İngilizce
Konular
Ahşap Esaslı Kompozitler
Bölüm
Araştırma Makalesi
Yayımlanma Tarihi
25 Haziran 2026
Gönderilme Tarihi
20 Nisan 2026
Kabul Tarihi
19 Haziran 2026
Yayımlandığı Sayı
Yıl 2026 Cilt: 7 Sayı: 1