Mechanical and Microstructural Properties of In, Ag, Al Doped Lead-Free Sn-Zn Solder Alloy Systems

Yıl 2022, Cilt: 22 Sayı: 3, 477 - 485, 30.06.2022

Esra Öztürk

https://doi.org/10.35414/akufemubid.1075864

Öz

Sn-Zn based lead free alloys are considered for replacing lead containing alloy systems for soldering. In this paper, In, Ag, Al doped Sn-Zn based systems were produced and investigated for mechanical and microstructural properties to obtain the most suitable system. Microstructures were observed by using an optic microscope. The samples' existing phases were investigated by using Energy Dispersive X-Ray analysis (EDX). Melting temperatures, the enthalpy of fusion and the specific heat change between the liquid and solid phases in the systems were determined with Differential Scanning Calorimetry (DSC). Also, microhardness values were measured at room temperature.

Anahtar Kelimeler

Lead-free solder systems, Mechanical properties, Microstructure, Differential Scanning Calorimetry, Microhardness

In, Ag, Al Katkılı Kurşunsuz Sn-Zn Lehim Alaşım Sistemlerinin Mekanik ve Mikroyapısal Özellikleri

Öz

Sn-Zn bazlı kurşunsuz alaşımlar, lehimleme için kurşun içeren alaşım sistemlerinin yerine kullanılmak üzere düşünülmektedir. Bu çalışmada, In, Ag, Al katkılı Sn-Zn esaslı sistemler üretilmiş ve en uygun sistemin elde edilmesi için mekanik ve mikro yapısal özellikler incelenmiştir. Mikro yapılar bir optik mikroskop kullanılarak gözlemlenmiştir. Numunelerin mevcut fazları Enerji Dağılım X-Işını Spektrometresi (EDX) kullanılarak araştırılmıştır. Sistemlerdeki erime sıcaklıkları, füzyon entalpisi ve sıvı ve katı fazlar arasındaki özgül ısı değişimi Diferansiyel Taramalı Kalorimetre (DSC) ile belirlenmiştir. Ayrıca oda sıcaklığında mikrosertlik değerleri de ölçülmüştür.

Anahtar Kelimeler

Kurşunsuz Lehim Sistemleri, Mekanik Özellikler, Mikroyapı, Diferansiyel Taramalı Kalorimetre, Mikrosertlik

Kaynakça

• Abtewa M., Selvaduray G., 2000. Lead-free Solders in Microelectronics. Materials Science and Engineering: R: Reports, 27(5), 95-141.
• Aksöz S., Ata Esener P., Öztürk E., Maraslı N., 2021. Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems. Journal of Materials Science: Materials in Electronics, 33(9), 11-26.
• Artaki I., Jackson A.M., Vianco P.T., 1994. Evaluation of Lead- Free Solder Joints in Electronic Assemblies. Journal Of Electronic Materials, 23(8), 757-764.
• Callister W.D., Rethwisch D.G., 2008. Materials Science and Engineering an Introduction, 8th ed., John Wiley & Sons, Inc., 175.
• Chou C.Y., Chen S.W., 2006. Phase equilibria of the Sn–Zn–Cu ternary system. Acta Materialia. 54, 2393–2400.
• Doğan A., Arslan H., 2019. An investigation of influencing of Sb and Bi contents on surface tensions associated with Pb-free Sn-Zn-Sb-Bi quaternary and sub-quaternary solder alloys. Philosophical Magazine. 99(15), 1825-1848.
• Doğan A., Arslan H., 2018. Assessment of Thermodynamic Properties of Lead-Free Soldering Co-Sb-Sn, Ag-In-Pd-Sn, and Ni-Cr-Co-Al-Mo-Ti-Cu Alloys. Physics of Metals and Metallography. 119(10), 976-992. Doğan A., Arslan H., 2018. Thermophysical properties of Cu–In–Sn liquid Pb-free alloys: viscosity and surface tension. Philosophical Magazine. 98(1), 37-53.
• El-Bahay M.M., El Mossalamy M.E., Mahdy M., Bahgat A.A., 2004. Some Mechanical Properties of Sn-3.5Ag eutectic alloy at different temperatures, Journal of Materials Science: Materials in Electronics, 15, 519-526.
• Ghosh G., Loomans M., Fine M.E., 1994. An Investigation of Phase Equilibria of the Bi-Sb-Sn System. Journal Of Electronic Materials, 23(7), 619-624.
• Gündüz M., Hunt J.D., 1985. The measurement of solid−liquid surface energies in the Al−Cu, Al− Si and Pb−Sn systems. Acta Metallurgica, 33, 1651–1672.
• Hung Y., Wang C.J., Huang S.M., Chen L.H., Lui T.S., 2006. Thermoelectric characteristics and tensile properties of Sn–9Zn–xAg lead-free solders. Journal of Alloys and Compounds, 420, 193–198.
• Kang H., Rajendran S.H., Jung J.P., 2021. Low melting temperature Sn-Bi solder: effect of alloying and nanoparticle addition on the microstructural, thermal, interfacial bonding, and mechanical characteristics. Metals, 11, 364-388.
• Kang S.K., Sarkhel A.K., 1994. Lead (Pb)-free solders for electronic packaging. Journal Of Electronic Materials, 23(8), 701-707.
• Kattner U.R., Boettinger W.J., 1994. On the Sn-Bi-Ag Ternary Phase Diagram. Journal Of Electronic Materials, 23(7), 603-610.
• Lee B.J., Hwang N.M., Lee H.M., 1997. Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation. Acta Materialia, 45(5), 1867-1874.
• Li Y., Chen C., Yi R., Ouyang Y., 2020. Review: Special brazing and soldering. Journal of Manufacturing Processes, 60, 608-635.
• Loomans M.E., Vaynman S., Ghosh G., Fine M.E., 1994. Investigation of Multi-Component Lead-free Solders. Journal Of Electronic Materials, 23(8), 741-746.
• Maraşlı N., Hunt J.D., 1996. Solid−liquid surface energies in the Al−CuAl2, Al−NiAl3 and Al− Ti systems, Acta Metallurgica, 44, 1085–1096.
• Marshall J.L., 1991. Scanning Electron Microscopy and Energy Dispersive X-ray (SEM/EDX) Characterization of Solder Solderability and Reliability, Springer Science+Business Media, New York, 173.
• Mc Cormack M., Jin S., 1994. New Lead-Free Solders Journal of Electronic Materials, 23(7), 635-640.
• Mc Cormack M., Jin S., 1994. Improved mechanical properties in new Pb-free solder alloys. Journal Of Electronic Materials, 23(8), 715-720.
• Mc Cormack M., Jin S., Kammlott G.W., Chen H.S., 1993. New Pb‐free solder alloy with superior mechanical properties. Applied Physics Letters, 63, 15.
• Mc Cormack M., Jin S., Chen H.S., Machusak D.A., 1994. New Lead-Free, Sn-Zn-In Solder Alloys. Journal Of Electronic Materials, 23(7), 687-690.
• Mei Z., Morris J.W., 1992. Superplastic Creep of Low Melting Point Solder Joints. Journal Of Electronic Materials, 21(4), 401-407.
• Powers J.M., 2010. Department of Aerospace and Mechanical Engineering University of Notre Dame, USA, 124, 130, 135.
• Rashidi R., Naffakh-Moosavy H., 2021. Metallurgical, physical, mechanical and oxidation behavior of lead-free chromium dissolved Sn–Cu–Bi solders. Journal of Materials Research and Technology, 13, 1805-1825.
• Samsonov G.V., 1968. Mechanical Properties of the Elements, Handbook of the physicochemical properties of the elements. IFI-Plenum, New York, USA.
• Sivasankaran S., Ramkumar K.R., Ammar H.R., Al-Mufadi F.A., Alaboodi A.S., Irfan O. M., 2021. Microstructural evolutions and enhanced mechanical performance of novel Al-Zn die-casting alloys processed by squeezing and hot extrusion, Journal of Materials Processing Technology. 292, 117063.
• Suganuma K., 2001. Advances in lead-free electronics soldering. Current Opinion in Solid State & Materials Science, 5, 55–64.
• Wood E.P., Nimmo K.L., 1994. In search of new lead-free electronic solders. Journal Of Electronic Materials, 23(8), 709-713.
• Xing F., Qiu X., 2015. Thermal Properties, Electrochemical Behavior, and Microstructure of Zn-5Sn-2Cu-1.5Bi-xRE High-Temperature Solder. Journal of Materials Engineering and Performance, 24, 1679-1686.
• Xing F., Qiu X.M., Li Y.D., 2015. Effects of Sn element on microstructure and properties of Zn–Cu–Bi–Sn high-temperature solder. Transactions of Nonferrous Metals Society of China, 25(3), 879-884.