Araştırma Makalesi

Experimental Analysis and Finite Element Modeling of S-Core Sandwich Panel Composites Drop Impact Response

Cilt: 15 Sayı: 1 29 Mart 2024
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Experimental Analysis and Finite Element Modeling of S-Core Sandwich Panel Composites Drop Impact Response

Abstract

Sandwich panel composites have several applications in material technology. The sandwich panel composite material is constructed of stainless steel-316 for the top and bottom plates, aluminum 1050A-0 for the core, and DP-8405 acrylic adhesive for the binding element. The impact behavior of S-core composite sandwich panels was examined using low-velocity drop impact tests and finite element models. Finite element models have been created to characterize the influence of composite element bending behavior on variations. The specific flexural modulus and strength of composite S-core sandwich structures are equivalent to those found in the literature for core structures. As a result, the minimum weight design served as a guideline for producing weight and density-efficient hybrid composite sandwich panels. The energy absorbed in the test findings rose between 15.15% and 30% as the core thickness grew and between 3.571% and 41.34% as the core arrays changed. Impact load-bearing capability increases with varied core heights and array designs.

Keywords

Destekleyen Kurum

Inonu University

Proje Numarası

BAP Project Code: FDK-2020-2306

Teşekkür

This research was supported by Inonu University (BAP Project Code: FDK-2020-2306). The authors thank Inonu University for funding the project.

Kaynakça

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Ayrıntılar

Birincil Dil

İngilizce

Konular

Malzeme Tasarım ve Davranışları

Bölüm

Araştırma Makalesi

Erken Görünüm Tarihi

29 Mart 2024

Yayımlanma Tarihi

29 Mart 2024

Gönderilme Tarihi

25 Eylül 2023

Kabul Tarihi

15 Ocak 2024

Yayımlandığı Sayı

Yıl 2024 Cilt: 15 Sayı: 1

Kaynak Göster

IEEE
[1]H. M. Öztemiz ve Ş. Temiz, “Experimental Analysis and Finite Element Modeling of S-Core Sandwich Panel Composites Drop Impact Response”, DÜMF MD, c. 15, sy 1, ss. 131–139, Mar. 2024, doi: 10.24012/dumf.1365978.
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