Araştırma Makalesi
BibTex RIS Kaynak Göster
Yıl 2022, Cilt: 11 Sayı: 2, 83 - 90, 01.07.2022
https://doi.org/10.18245/ijaet.830838

Öz

Destekleyen Kurum

Marelli MAKO Turkey Elektrik Sanayi ve Ticaret A.Ş.

Kaynakça

  • Choi, S., Kim, Y., Byun S., Choi K. A Study on Predictable Program of LED Junction Temperature in Natural Convection. 9th International Symposium on Automotive Lighting, 27-28 September 2011, Darmstadt, Germany.
  • Tsai, M., Chen, C., Kang, C. (2012) “Thermal measurements and analyses of low-cost high-power LED packages and their modules”, Microelectronics Reliability, 52: 845 – 854
  • Kikuchi, K. Thermal simulation of LED unit for Headlamp and Rear lamp. 9th International Symposium on Automotive Lighting, 27-28 September 2011, Darmstadt, Germany.
  • Yung, K., Liem, H., Choy, H., Lun W., (2010) Thermal performance of high brightness LED array package on PCB. International Communications in Heat and Mass Transfer, 37: 1266 – 1272
  • Mornet E., (2009). Thermal management of LED for signaling and lighting functions. 8th International Symposium on Automotive Lighting, 28-30 September, Darmstadt, Almanya
  • Christensen A., Graham S., (2009). Thermal effects in packaging high power light emitting diode arrays Applied Thermal Engineering 29 pp.364–371
  • Keppens A., Chen h., Lu Y., Chen Z., Gao Y., Deconinck G., Hanselaer P. (2011) “Light-emitting diode junction temperature and power Determination from forward current”. Light & Engineering, 19(1): 34-44.
  • Kwok K.F., Divakar B.P., Cheng K.W.E., Design of an LED Thermal System for Automotive Systems 3rd International Conference on Power Electronics Systems and Applications, Hong Kong, China 20-22 May 2009
  • Cheng T., Luo X., Huang S., Liu S. (2010) “Thermal analysis and optimization of multiple LED packaging based on a general analytical solution”. International Journal of Thermal sciences, 49: 196 – 201.
  • Saati K. F., Tufekci, C.S., Arik M. A Computational and Experimental Study on a Harsh Environment LED System for Vehicle Exterior Lighting Applications. 4th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 27-30 May 2014, Orlando, FL, USA

Thermal performance investigation of position function circuit board used in automotive exterior rear lighting

Yıl 2022, Cilt: 11 Sayı: 2, 83 - 90, 01.07.2022
https://doi.org/10.18245/ijaet.830838

Öz

In this research, both numerically and experimentally, the thermal efficiency of a Printed Circuit Board (PCB) with two Light Emitting Diode (LED) chips was examined. The two LED lighting systems, which are single-cell LEDs, including PCB and copper plates, were manufactured, and tested under laboratory conditions to achieve this goal. The three-dimensional Computational Fluid Dynamics (CFD) model with natural convection effects prepared using the FloEFD software package to predict PCB surface temperature distributions. The goal was to perform comprehensive circuit board simulation and validate the numerical model built in this study using the experimental data during the studies. From the results, we can easily claim that higher temperature gradients are calculated and predicted near the LED chip because of heat generation. Data paths have played an essential role in the LED circuit board's temperature distribution. High-temperature variations are observed at short distances around the LED when the experimental and simulation results are compared. Temperature changes are minimized as they travel away from the LED chip. It is found that the error rate is below 5 percent overall between the experimental and simulation results. The numerical results were in proper alignment with numerical data obtained from the three-dimensional (3D) CFD model. Given thermal efficiency and using such models, this model can design and analyze Automotive Lighting Systems.

Kaynakça

  • Choi, S., Kim, Y., Byun S., Choi K. A Study on Predictable Program of LED Junction Temperature in Natural Convection. 9th International Symposium on Automotive Lighting, 27-28 September 2011, Darmstadt, Germany.
  • Tsai, M., Chen, C., Kang, C. (2012) “Thermal measurements and analyses of low-cost high-power LED packages and their modules”, Microelectronics Reliability, 52: 845 – 854
  • Kikuchi, K. Thermal simulation of LED unit for Headlamp and Rear lamp. 9th International Symposium on Automotive Lighting, 27-28 September 2011, Darmstadt, Germany.
  • Yung, K., Liem, H., Choy, H., Lun W., (2010) Thermal performance of high brightness LED array package on PCB. International Communications in Heat and Mass Transfer, 37: 1266 – 1272
  • Mornet E., (2009). Thermal management of LED for signaling and lighting functions. 8th International Symposium on Automotive Lighting, 28-30 September, Darmstadt, Almanya
  • Christensen A., Graham S., (2009). Thermal effects in packaging high power light emitting diode arrays Applied Thermal Engineering 29 pp.364–371
  • Keppens A., Chen h., Lu Y., Chen Z., Gao Y., Deconinck G., Hanselaer P. (2011) “Light-emitting diode junction temperature and power Determination from forward current”. Light & Engineering, 19(1): 34-44.
  • Kwok K.F., Divakar B.P., Cheng K.W.E., Design of an LED Thermal System for Automotive Systems 3rd International Conference on Power Electronics Systems and Applications, Hong Kong, China 20-22 May 2009
  • Cheng T., Luo X., Huang S., Liu S. (2010) “Thermal analysis and optimization of multiple LED packaging based on a general analytical solution”. International Journal of Thermal sciences, 49: 196 – 201.
  • Saati K. F., Tufekci, C.S., Arik M. A Computational and Experimental Study on a Harsh Environment LED System for Vehicle Exterior Lighting Applications. 4th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 27-30 May 2014, Orlando, FL, USA
Toplam 10 adet kaynakça vardır.

Ayrıntılar

Birincil Dil İngilizce
Konular Makine Mühendisliği
Bölüm Article
Yazarlar

Birhat Sönmezay 0000-0002-8432-6192

Mehmet Aktaş 0000-0003-1552-9946

Yayımlanma Tarihi 1 Temmuz 2022
Gönderilme Tarihi 25 Kasım 2020
Yayımlandığı Sayı Yıl 2022 Cilt: 11 Sayı: 2

Kaynak Göster

APA Sönmezay, B., & Aktaş, M. (2022). Thermal performance investigation of position function circuit board used in automotive exterior rear lighting. International Journal of Automotive Engineering and Technologies, 11(2), 83-90. https://doi.org/10.18245/ijaet.830838
AMA Sönmezay B, Aktaş M. Thermal performance investigation of position function circuit board used in automotive exterior rear lighting. International Journal of Automotive Engineering and Technologies. Temmuz 2022;11(2):83-90. doi:10.18245/ijaet.830838
Chicago Sönmezay, Birhat, ve Mehmet Aktaş. “Thermal Performance Investigation of Position Function Circuit Board Used in Automotive Exterior Rear Lighting”. International Journal of Automotive Engineering and Technologies 11, sy. 2 (Temmuz 2022): 83-90. https://doi.org/10.18245/ijaet.830838.
EndNote Sönmezay B, Aktaş M (01 Temmuz 2022) Thermal performance investigation of position function circuit board used in automotive exterior rear lighting. International Journal of Automotive Engineering and Technologies 11 2 83–90.
IEEE B. Sönmezay ve M. Aktaş, “Thermal performance investigation of position function circuit board used in automotive exterior rear lighting”, International Journal of Automotive Engineering and Technologies, c. 11, sy. 2, ss. 83–90, 2022, doi: 10.18245/ijaet.830838.
ISNAD Sönmezay, Birhat - Aktaş, Mehmet. “Thermal Performance Investigation of Position Function Circuit Board Used in Automotive Exterior Rear Lighting”. International Journal of Automotive Engineering and Technologies 11/2 (Temmuz 2022), 83-90. https://doi.org/10.18245/ijaet.830838.
JAMA Sönmezay B, Aktaş M. Thermal performance investigation of position function circuit board used in automotive exterior rear lighting. International Journal of Automotive Engineering and Technologies. 2022;11:83–90.
MLA Sönmezay, Birhat ve Mehmet Aktaş. “Thermal Performance Investigation of Position Function Circuit Board Used in Automotive Exterior Rear Lighting”. International Journal of Automotive Engineering and Technologies, c. 11, sy. 2, 2022, ss. 83-90, doi:10.18245/ijaet.830838.
Vancouver Sönmezay B, Aktaş M. Thermal performance investigation of position function circuit board used in automotive exterior rear lighting. International Journal of Automotive Engineering and Technologies. 2022;11(2):83-90.