EN
EFFECT of TEMPERAUTRE on PACK SILICONIZING of Ti6Al4V ALLOY
Öz
This study aims to investigate the temperature effects on silicide coating formed by pack siliconizing method on Ti6Al4V subsrate. Pack siliconizing process was conducted out for 2h at 1000°C, 1100°C, 1200°C, in vacum atmosphere, by using Si as Si source, Al2O3 powder as filler and NH4Cl as an activator. The presence of the formed phases such as Ti5Si3, TiSi, TiSi2 on coating, and non-stoichiometric Al203 compound from the pack mixture was actualized by X-ray diffraction analysis (XRD). It was obeserved that the silicide coating on Ti6Al4V substrate is compact, dense and the coating thickness varies between 10.5-30.4 μm depending on the treatment temperature. The morphological feautres of the coating and dispersion of the elements in the silicide layer was examined by using electron microscope (SEM) and elemental analysis (EDS). Hardness of silicide layer measured by Vickers method and determined that the hardness ranges between 1170 Hv0,025 to 1450 HV 0,025 .
Anahtar Kelimeler
Destekleyen Kurum
Sakarya Uygulamalı Bilimler Üniversitesi BAPK
Proje Numarası
2021-50-01-063
Kaynakça
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Ayrıntılar
Birincil Dil
İngilizce
Konular
Yapay Zeka
Bölüm
Araştırma Makalesi
Yayımlanma Tarihi
29 Haziran 2022
Gönderilme Tarihi
17 Mart 2022
Kabul Tarihi
15 Nisan 2022
Yayımlandığı Sayı
Yıl 2022 Cilt: 3 Sayı: 1
APA
Çelebi Efe, G., Tepe, E. F., & Yener, T. (2022). EFFECT of TEMPERAUTRE on PACK SILICONIZING of Ti6Al4V ALLOY. Journal of Smart Systems Research, 3(1), 11-21. https://izlik.org/JA49CL79BH
AMA
1.Çelebi Efe G, Tepe EF, Yener T. EFFECT of TEMPERAUTRE on PACK SILICONIZING of Ti6Al4V ALLOY. JoinSSR. 2022;3(1):11-21. https://izlik.org/JA49CL79BH
Chicago
Çelebi Efe, Gözde, Eşref Furkan Tepe, ve Tuba Yener. 2022. “EFFECT of TEMPERAUTRE on PACK SILICONIZING of Ti6Al4V ALLOY”. Journal of Smart Systems Research 3 (1): 11-21. https://izlik.org/JA49CL79BH.
EndNote
Çelebi Efe G, Tepe EF, Yener T (01 Haziran 2022) EFFECT of TEMPERAUTRE on PACK SILICONIZING of Ti6Al4V ALLOY. Journal of Smart Systems Research 3 1 11–21.
IEEE
[1]G. Çelebi Efe, E. F. Tepe, ve T. Yener, “EFFECT of TEMPERAUTRE on PACK SILICONIZING of Ti6Al4V ALLOY”, JoinSSR, c. 3, sy 1, ss. 11–21, Haz. 2022, [çevrimiçi]. Erişim adresi: https://izlik.org/JA49CL79BH
ISNAD
Çelebi Efe, Gözde - Tepe, Eşref Furkan - Yener, Tuba. “EFFECT of TEMPERAUTRE on PACK SILICONIZING of Ti6Al4V ALLOY”. Journal of Smart Systems Research 3/1 (01 Haziran 2022): 11-21. https://izlik.org/JA49CL79BH.
JAMA
1.Çelebi Efe G, Tepe EF, Yener T. EFFECT of TEMPERAUTRE on PACK SILICONIZING of Ti6Al4V ALLOY. JoinSSR. 2022;3:11–21.
MLA
Çelebi Efe, Gözde, vd. “EFFECT of TEMPERAUTRE on PACK SILICONIZING of Ti6Al4V ALLOY”. Journal of Smart Systems Research, c. 3, sy 1, Haziran 2022, ss. 11-21, https://izlik.org/JA49CL79BH.
Vancouver
1.Gözde Çelebi Efe, Eşref Furkan Tepe, Tuba Yener. EFFECT of TEMPERAUTRE on PACK SILICONIZING of Ti6Al4V ALLOY. JoinSSR [Internet]. 01 Haziran 2022;3(1):11-2. Erişim adresi: https://izlik.org/JA49CL79BH