Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate

Öz

In this study, effect of melting temperatures of Sn-3Ag (SAC300), Sn-3Ag-0.5Cu (SAC305) and Sn-0.3Ag-0.7Cu (SAC0307) ternary Pb-free solder alloys on wettability were investigated. The sessile drop technique was used in order to evaluate the contact angles of Pb-free solder alloys on Cu substrate at predetermined temperatures (250, 280 and 310 ). The melting temperatures of alloys were examined by differential scanning calorimeter (DSC) that SAC305 Pb-free alloy has lower than those of SAC300 and SAC0307 alloys. The best wettability was found for SAC305 and this was followed by SAC300 and SAC0307. The lowest value of contact angle for SAC305 was 41.90  at 310  on Cu substrate.

Anahtar Kelimeler

• Contact angle,melting temperature,wettability

Kaynakça

1. [1] Çağlarırmak, N., Hepçimen, A. Z., "Effect of Heavy Metal Soil Pollution on Food Chain and Human Health", Akademik Gıda, 8(2): 31-35 (2010).
2. [2] Das, S.K., Sharif, A., Chan, Y.C., Wong, N.B., Yung, W.K.C., " Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy", J. Alloys Comp., 481(1-2): 167-172 (2009).
3. [3] Yang M., Ji H., Wang S., Ko Y.H., Lee C. W., Wu J., Li M. "Effects of Ag content on the interfacial reactions between liquid Sn-Ag-Cu solders and Cu substrates during soldering" Journal of Alloys and Compounds, 679:18-25, (2016).
4. [4] Duong, N. B.,Ariga, T., Hussain,L. B. and Ismail, A. B., " Wettability of lead-free solders on gold-plated copper substrates", Materials Transactions, 49(6): 1462-1466 (2008).
5. [5] Yoon, S. W.,Choi,W. K. and Lee, H. M., "Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate", Scripta Materialia, 40(3): 297–302 (1999).
6. [6] Yuan, Y., Lee, T. R., " Contact Angle and Wetting Properties", Surface Science Techniques, Springer Series in Surface Sciences, 51: 3-34 (2013).
7. [7] Kumar, G., Prabhu, K. N., "Review of non-reactive and reactive wetting of liquids on surfaces", Advances in Colloid and Interface Science, 133(2): 61–89 (2007).
8. [8] Zhang, X.,Yuan, Z., Zhao, H., Zang, L. and LI, J., "Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate" Chinese Science Bulletin, 55(9): 797-801 (2010).

9. [9] Zhang, X., Matsuura, H.,Tsukihashi, F.and Yuan,Z., " Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn¬Ag¬Cu Solder Joints during Thermal Cycling", Material Transactions, 53(5): 926-931 (2012).
10. [10] Omac, F., Ozyurek, D.and Erer, M., "Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate", Acta Physica Polonocia- A, 131(1):165-167 (2017).
11. [11] Erer, A. M., Candan, E., Güven, M. H., Turen, Y., “Measurement and prediction of contact angles of Pb-free SnAg solder alloys on Cu substrate”, Eur. Phys. J. Appl. Phys., 54(1), 1-4, (2011).