Comparison of different universal adhesives’ bond strength to laser-assisted bleached enamel

Yıl 2019, Cilt: 6 Sayı: 1, 30 - 37, 01.04.2019

Fatma Dilsad Oz , Ayşe Rüya Yazıcı , Cansu Atalay

https://doi.org/10.15311/selcukdentj.419367

Öz

Objective:
The aim
of this in vitro study was to
evaluate the bond strength of several universal adhesives used in different
application modes to laser-assisted bleached enamel.

Materials
and Methods: Freshly
extracted 72 sound bovine incisors were used for the study. The teeth were
bleached with 38% of hydrogen peroxide gel that was activated with a diode
laser (Epic). The diode laser
with a 949nm wavelength was used at 7 W in continuous mode for 30 s. After
bleaching procedure, the teeth were kept in artificial saliva for 2 weeks. The bleached teeth were randomly assigned into three groups according to
different universal adhesive systems (n=24); Single Bond Universal-SU,
All-Bond Universal-ABU and Adhese Universal-ADU. All
adhesives were applied in two modes: a- etch&rinse (ER); and b- self etch
(SE). A cylinder-shaped resin composite was placed on treated surfaces and
cured. After storage of specimen in distilled water for 24 h, they were
subjected to shear bond strength test. Data were analyzed using two-way ANOVA
followed by Bonferroni test (α = 0.05)

Results: The
highest mean shear bond strength values were obtained in Single
Bond Universal group used in self-etch mode (p<0.05). No difference was
observed between All-Bond Universal and Adhese Universal. In etch&rinse
application mode, Adhese Universal resulted in significantly lower bond
strength values (p<0.05) than Single Bond Universal and All-Bond Universal. For all groups, etch&rinse application mode caused significantly
higher bond strength values.

Conclusion: The
bonding performance of tested universal adhesives was enhanced with the
etch&rinse mode application  to diode
laser- assisted bleached enamel. 

Key Words: Diode
laser, universal adhesives, bleaching

Anahtar Kelimeler

Diode laser, universal adhesives, bleaching

Farklı üniversal adezivlerin lazerle beyazlatılmış mineye bağlanma dayanıklılıklarının karşılaştırılması

Öz

Amaç: Bu in
vitro çalışmanın amacı farklı universal adezivlerin kesme-bağlanma
dayanıklılıklarının  farklı uygulama
şekillerinde, lazerle beyazlatma sonrası değerlendirilmesidir.

Gereç ve
Yöntem: Bu çalışmada yeni çekilmiş 72 kesici sığır dişi kullanılmıştır. Dişler,
diyot lazerle (Epic) aktive edilen %38'lik hidrojen peroksit jel
beyazlatılmıştır. Diyot lazer   949 nm
dalga boyu ve 7 W'lık devamlı modda 30 saniye kullanılmıştır. Beyazlatma
sonrası, dişler yapay tükürükte 2 hafta bekletilmiştir. Beyazlatılmış dişler,
farklı universal adeziv sistemlere göre rastgele 3 gruba ayrılmıştır (n=24): Single Bond
Universal-SU, All-Bond Universal-ABU ve Adhese Universal-ADU. Tüm adezivler 2
modda uygulanmıştır: a- etch&rinse (ER); ve b- self etch (SE). Silindir
şekilli kompozit rezin beyazlatma uygulanmış yüzeylere yerleştirilmiş ve ışıkla
polimerize edilmiştir. Örnekler 24 saat distile suda bekletildikten sonra kesme
bağlanma dayanıklılığı testine maruz bırakılmıştır. Veriler 2 yönlü ANOVA ve
Bonferroni testi kullanılarak analiz edilmiştir(α
= 0.05).

Bulgular: Self-etch modda en yüksek kesme bağlanma dayanıklılığı
değerleri Single
Bond Universal grubunda görülmüştür (p<0.05). All-Bond Universal ve Adhese
Universal gruplarında istatistiksel olarak anlamlı bir fark görülmemiştir.
Etch&rinse uygulama modunda Adhese Universal, anlamlı bir şekilde Single
Bond Universal ve All-Bond Universal'den daha düşük kesme bağlanma
dayanıklılığı değerleri göstermiştir (p<0.05). Tüm gruplarda etch&rinse
uygulama modu anlamlı bir şekilde daha yüksek 
kesme bağlanma dayanıklılığı değerleri göstermiştir.

Sonuçlar: Universal
adezivlerin bağlanma dayanıklılıkları, diyot lazerle beyazlatma sonrası
etch&rinse uygulama şeklinde  daha
yüksek değerler göstermiştir.

Anahtar Kelimeler: Diyot lazer,
universal adezivler, beyazlatma

Anahtar Kelimeler

Diyot lazer, universal adezivler, beyazlatma

Kaynakça

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