Thermal Analysis of Al and Cu Metals Heat Sinks with Different Geometries at Raspberry Pi Control Cards Used for Image Analysis-Based Drone Control in Smart Agriculture Drones

Yıl 2023, Sayı: 378, 29 - 41, 30.12.2023

Abdullah Beyaz

https://doi.org/10.33724/zm.1344450

Öz

A heat sink is a tool for dissipating the heat generated by electronic parts. The equipment's specific operating conditions necessitate the equipment's extra heat dissipation. This research compared and optimized the temperature and heat flux parameters based on the results of the design of a heat sink for CPU, RAM, and PCLe to a USB 3.0 bridge. It is aimed at an examination of the advantages and disadvantages of using square, rectangular, and circular shapes in the design of a heat sink. Copper and aluminum (Al) are the most common heat sink materials (Cu). Autodesk Inventor Pro software with Nastran module is used for design and thermal analysis.
According to Inventor Nastran's thermal analysis results it is found that there is no significant difference between Al and Cu materials based on cooling capacity at designed models. Also, it is found that the geometry of the heat sinks directly affects the cooling capacity of a heat sink.
The application results show that the cooling achievement is directly related to the correct heatsink design and enough surface area.
According to Inventor Nastran's thermal analysis results it is found that there is no important difference between Al and Cu materials based on cooling capacity at designed models. Also, it is found that the geometry of the heat sinks directly affects the cooling capacity of a heat sink.
The application results show that the cooling achievement is directly related to the correct heatsink design and enough surface area.

Anahtar Kelimeler

Heat sink, Heat transfer, Thermal design, Al and Cu metals, Raspberry Pi

Akıllı Tarım Drone'larında Görüntü Analizi Tabanlı Drone Kontrolünde Kullanılan Raspberry Pi Kontrol Kartları İçin Farklı Geometrilere Sahip Al ve Cu Metal Isı Alıcılarının Termal Analizi

Öz

Bir ısı alıcı, elektronik parçalar tarafından üretilen ısıyı dağıtmak için bir araçtır. Ekipmanların belirtilen çalışma koşulları sahip oldukları fazla ısının dağılımını gerektirir. Bu çalışmada, CPU, RAM ve PCLe den USB 3.0 köprüsü için ısı alıcı tasarımındaki sıcaklık ve ısı akışı parametrelerinin sonuçları karşılaştırılıp optimize edilmiştir. Bir ısı alıcı tasarımında kare, dikdörtgen ve dairesel tasarım şekilleri kullanmanın avantaj ve dezavantajlarının incelemesi yapılmıştır. Bakır (Cu) ve alüminyum (Al) en yaygın ısı emici malzemelerdir.
Tasarım ve termal analiz aşamaları için Nastran modülüne sahip Autodesk Inventor Pro yazılımından yararlanılmıştır. Autodesk Inventor Pro Nastran termal analiz sonuçlarına göre, tasarlanan modellerde soğutma kapasitesi bazında Al ve Cu malzemeleri arasında önemli bir fark olmadığı bulunmuştur. Ayrıca sonuç olarak ısı alıcıların geometrisinin bir ısı alıcının soğutma kapasitesini doğrudan etkilediği belirlenmiştir.
Araştırma sonuçları, soğutma başarısının doğru ısı alıcı tasarımı ve yeterli yüzey alanı ile doğrudan ilişkili olduğunu göstermiştir.

Anahtar Kelimeler

Soğutucu, ısı transferi, termal tasarım, Al ve Cu Metaller, Raspberry Pi

Kaynakça

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