The rapid progress of deep learning has transformed the detection of soldering defects in printed circuit boards (PCBs), outperforming traditional manual inspections and rule-based machine vision systems.This study evaluates the performance of state-of-the-art YOLO models—specifically YOLOv11 and YOLOv12—for both object detection and instance segmentation of solder defects in aerospace PCBs using the open-source SolDef_AI dataset. We compare multiple variants (nano, small, and medium) to assess their accuracy, efficiency, and suitability for industrial quality control. Our experiments reveal that YOLO-v11s-seg achieves the highest mean average precision (mAP50-95: 0.853 for detection, 0.822 for segmentation), demonstrating superior defect localization capabilities, particularly for challenging classes such as "poor_solder" and "spike." While YOLOv12 models exhibit competitive detection performance, they show slightly lower segmentation accuracy, indicating potential areas for architectural refinement. Smaller models (YOLO-v11n, YOLO-v12n) offer a favorable balance between speed and precision, making them viable for real-time applications. The findings highlight the effectiveness of YOLO-based deep learning in automating solder defect inspection, with implications for improving manufacturing quality assurance in electronics production.
Image Processing Object Detection Quality Control Soldering Defect Detection
| Birincil Dil | İngilizce |
|---|---|
| Konular | Yazılım Mühendisliği (Diğer) |
| Bölüm | Araştırma Makalesi |
| Yazarlar | |
| Gönderilme Tarihi | 2 Nisan 2025 |
| Kabul Tarihi | 7 Ekim 2025 |
| Yayımlanma Tarihi | 29 Aralık 2025 |
| Yayımlandığı Sayı | Yıl 2025 Cilt: 21 Sayı: 4 |