Effect of bismuth addition on the corrosion dynamics of Sn–3Ag–0.5Cu solder alloy in Hydrochloric Acid Solution

Yıl 2021, , 40 - 44, 28.06.2021

Ahmet Mustafa Erer

https://doi.org/10.46460/ijiea.911862

Cited By: 2

Öz

This paper aims to investigate the effect of bismuth addition on the corrosion behaviour of Sn–3.0Ag–0.5Cu (SAC 305) solder alloy in 1M HCl acid solution under potentiodynamic polarization. After electrochemical tests, scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX) were used to examine the properties of the samples. Polarization studies indicated that an addition of 0.5, 1, and 2 wt.% Bi in the SAC305 solder alloy doesn't lead to significantly different corrosion potentials. Instead of a true passivation region, a pseudo-passivation region is observed in which currents are nearly constant (though high). This pseudo-passive region does not have a reactivation point within the scanning interval. Corrosion rates, on the other hand, follow a pattern in which 1 wt.% bismuth replacement of silver causes a drop-in corrosion rate. With the further replacement of silver with bismuth, however, the corrosion rate increases. Microstructure analysis reveals the existence of gaps and porosities which introduce limits on the formation and stability of protective passive corrosion products.

Anahtar Kelimeler

Bi addition, Corrosion, Pb-free solder alloys, Microstructure

Hidroklorik Asit çözeltisinde bizmut ilavesinin Sn – 3Ag – 0.5Cu lehim alaşımının korozyon dinamiklerine etkisi

Öz

Bu makale, bizmut ilavesinin potansiyodinamik polarizasyon altında 1M HCl asit solüsyonunda Sn – 3.0Ag – 0.5Cu (SAC 305) lehim alaşımının korozyon davranışı üzerindeki etkisini araştırmayı amaçlamaktadır. Elektrokimyasal testlerden sonra, numunelerin özelliklerini incelemek için taramalı elektron mikroskobu (SEM) ve enerji dağıtıcı X-ışını spektroskopisi (EDX) kullanılmıştır. Polarizasyon çalışmaları, SAC305 lehim alaşımına ağırlıkça% 0,5, 1 ve 2 Bi ilavesinin önemli ölçüde farklı korozyon potansiyellerine yol açmadığını göstermiştir. Gerçek bir pasivasyon bölgesi yerine, akımların neredeyse sabit olduğu (yüksek olsa da) sözde pasivasyon bölgesi gözlenmiştir. Bu sözde pasif bölge, tarama aralığı içinde bir yeniden etkinleştirme noktasına sahip değildir. Öte yandan, korozyon oranları, gümüşün ağırlıkça% 1 bizmut ikamesinin korozyon oranının düşmesine neden olduğu bir modeli takip eder. Gümüşün bizmutla daha fazla yer değiştirmesi ile korozyon hızı artar. Mikroyapı analizi, koruyucu pasif korozyon ürünlerinin oluşumuna ve stabilitesine sınırlar getiren boşlukların ve gözeneklerin varlığını ortaya koymaktadır.

Anahtar Kelimeler

Bi ilavesi, Korozyon, Kurşunsuz lehim alaşımları, Mikroyapılar

Kaynakça

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