Araştırma Makalesi

The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles

Cilt: 27 Sayı: 4 25 Eylül 2024
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The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles

Öz

Soldering is performed in order to easily assemble electronic components and also to provide electrical conductivity. The strengths, hardness, physical properties and electronic properties of the solders, i.e. reduced energy loss, hardness, melting point and longer service life, can be achieved when their usage is improvised by the help of necessary alloying or neutral additions. In this study, the effect of the addition of sub micron sized activated carbon on the mechanical, physical and electrical properties of industrially used solders, i.e. Pb-Sn and lead free SC0.7 solder was investigated.The thermal studies showed that the melting point of Pb-Sn was lowered against lead free solders with increasing amount of activated carbon. The tensile shear strength of both solders did not improve with increasing amount of activated carbon. In lead-free solders, the electrical resistance values decrease with respect to increasing active carbon ratio, however, the resistance of Pb-Sn solders increased. The addition of active particles have positively affected the microstructure of Pb-Sn solders, resulting in a finer grains, whereas, the addition of active carbon particles have no effect on the grain structures of lead free solder.

Anahtar Kelimeler

Destekleyen Kurum

TÜBİTAK (2209A) ve Afyon Kocatepe Üniversitesi BAPK

Proje Numarası

15.FEN.BİL.43

Teşekkür

The authors are grateful to TÜBİTAK and Afyon Kocateoe University Scientific Research Project Commission for financially supoorting this project.

Kaynakça

  1. [1] Kotadia, H. R., Howes, P. D., Mannan, S. H., “A review: on the development of low melting temperature Pb-free solders”, Microelectronics Reliability, 54(6–7):1253-1273.
  2. [2] Jones, W. K., Liu, Y. Q., Zampino, M. A., Gonzalez, G. L., “the at-temperature mechanical properties of lead-tin based alloys”, In: Harman G., Mach P. (eds) Microelectronic Interconnections and Assembly. NATO ASI Series (3. High Technology), Springer, Dordrecht, (1998).
  3. [3] Karakaya, I., Thompson, W. T., “The Pb−Sn (lead-tin) system. Journal of Phase Equilibrium, 9: 144–152. (1988).
  4. [4] Demayo, A., Taylor, M. C., Taylor, K. W., Hadson, P. V. and Hammond, P.B., “Toxic effects of lead and lead compounds on human health, aquatic life, wildlife plants, and livestock”, Critical Review in Environmental Science and Technology, 12(4);257-305, (1982).
  5. [5] European Union, Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment. Official Journal of European Union, 46:19-23, (2002).
  6. [6] Suganuma, K., “Advances in lead-free electronics soldering”, Current Opinion in Solid State Materials Science, 5(1):55-64, (2001).
  7. [7] Aşçı, T., Keskin, H., "Strengthening the retention amount and leaching resistance of boron compounds used as impregnation material". Journal of Polytechnic, 24:103-112, (2021).
  8. [8] Aydogan, T., Şenberber Dumanlı, F. T., Möröydor Derun, E., "Effect of lemon peel extract concentration on nano scale Fe/Fe3O4 synthesis". Journal of Polytechnic, 25:1423-1427, (2022).

Ayrıntılar

Birincil Dil

İngilizce

Konular

Kaynak Teknolojileri

Bölüm

Araştırma Makalesi

Erken Görünüm Tarihi

8 Eylül 2023

Yayımlanma Tarihi

25 Eylül 2024

Gönderilme Tarihi

13 Haziran 2023

Kabul Tarihi

15 Ağustos 2023

Yayımlandığı Sayı

Yıl 2024 Cilt: 27 Sayı: 4

Kaynak Göster

APA
Talaş, Ş., Özkan, E., & Ayar, B. (2024). The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles. Politeknik Dergisi, 27(4), 1505-1514. https://doi.org/10.2339/politeknik.1313792
AMA
1.Talaş Ş, Özkan E, Ayar B. The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles. Politeknik Dergisi. 2024;27(4):1505-1514. doi:10.2339/politeknik.1313792
Chicago
Talaş, Şükrü, Elif Özkan, ve Bahattin Ayar. 2024. “The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles”. Politeknik Dergisi 27 (4): 1505-14. https://doi.org/10.2339/politeknik.1313792.
EndNote
Talaş Ş, Özkan E, Ayar B (01 Eylül 2024) The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles. Politeknik Dergisi 27 4 1505–1514.
IEEE
[1]Ş. Talaş, E. Özkan, ve B. Ayar, “The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles”, Politeknik Dergisi, c. 27, sy 4, ss. 1505–1514, Eyl. 2024, doi: 10.2339/politeknik.1313792.
ISNAD
Talaş, Şükrü - Özkan, Elif - Ayar, Bahattin. “The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles”. Politeknik Dergisi 27/4 (01 Eylül 2024): 1505-1514. https://doi.org/10.2339/politeknik.1313792.
JAMA
1.Talaş Ş, Özkan E, Ayar B. The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles. Politeknik Dergisi. 2024;27:1505–1514.
MLA
Talaş, Şükrü, vd. “The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles”. Politeknik Dergisi, c. 27, sy 4, Eylül 2024, ss. 1505-14, doi:10.2339/politeknik.1313792.
Vancouver
1.Şükrü Talaş, Elif Özkan, Bahattin Ayar. The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles. Politeknik Dergisi. 01 Eylül 2024;27(4):1505-14. doi:10.2339/politeknik.1313792
 
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