Araştırma Makalesi

In-Bi-Cd ÖTEKTİK ALAŞIMININ MİKROYAPISAL DEĞERLENDİRİLMESİ VE MEKANİK DAVRANIŞI

Cilt: 8 Sayı: 1 28 Ocak 2019
PDF İndir
EN TR

MICROSTRUCTURAL EVOLUTION AND MECHANICAL BEHAVIOR OF In–Bi–Cd EUTECTIC ALLOY

Abstract

   In–30.8%Bi–7.5%Cd (wt.) alloy was directional solidified at different growth rates (V=2.9–173.8 µm/s) in a Bridgman type equipment. The microstructure of In–Bi–Cd alloy was observed, which resulted lamellae of In2Bi phase, In–rich () phase, and Cd phase from quenched samples. The eutectic spacing, microhardness   and ultimate tensile strength of alloy were measured from directionally solidified samples, and the relationships between them were experimentally obtained using both linear regression analysis and Hall–Petch type correlations. The local lamellae and rod–like phase structures which were grown around primary In2Bi phase have been observed in the microstructure of the solidified alloys larger than 80 µm/s growth rate. As growth rate increases, the volume percentage of primary In2Bi phases increase. And also it was found that, as the growth rate increases from 2.9 to 173.8 µm/s, the values of microhardness and ultimate tensile strength increases about two times. The values of the eutectic spacing, microhardness and ultimate tensile strength for In–Bi–Cd eutectic alloys were compared with similar eutectic alloys.

Keywords

Kaynakça

  1. [1] MANKO H.H., “Solders and Soldering Materials: Design Production, Analysis for Reliable Bonding”, (fourth ed.), McGraw–Hill, New York, 2001.
  2. [2] NOOR E.E.M., SHARİF N.M., YEW C.K., ARİGA T., ISMAİL A.B., HUSSAİN Z., “Wettability and strength of In–Bi–Sn lead–free solder alloy on copper substrate.” Journal of Alloys and Compounds 507, 290–296, 2010.
  3. [3] McCORMACK M., CHEN H.S., KAMMLOTT G.W., JİN S., “Significantly improved mechanical properties of Bi-Sn solder alloys by Ag-doping” Journal of Electronic Materials 26, 954–958, 1997.
  4. [4] TAO D.P., “Prediction of activities of all components in the lead-free solder systems Bi-In-Sn and Bi-In-Sn-Zn” Journal of Alloys and Compounds 457, 124–130, 2008.
  5. [5] JIN S., McCORMACK M., “Dispersoid Additions to a Pb-Free Solder for Suppression of Microstructural Coarsening” Journal of Electronic Materials 23, 735–739, 1994.
  6. [6] ACOFF V.L., ARENAS M.F., “Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substrates” Journal of Electronic Materials 22, 1452–1458, 2004.
  7. [7] BANG W.H., MOON M.W., KİM C.U., KANG S.H., JUNG J.P., OH K.H., “Study of fracture mechanics in testing interfacial fracture of solder joints” Journal of Electronic Materials 37, 417–427, 2008.
  8. [8] SEO S., KANG S.K., SHIH D., LEE H.M., “An investigation of microstructure and microhardness of Sn–Cu and Sn–Ag solders as functions of alloy composition and cooling rate” Journal of Electronic Materials 38, 257–265, 2009.

Ayrıntılar

Birincil Dil

Türkçe

Konular

Mühendislik

Bölüm

Araştırma Makalesi

Yayımlanma Tarihi

28 Ocak 2019

Gönderilme Tarihi

2 Nisan 2018

Kabul Tarihi

17 Ekim 2018

Yayımlandığı Sayı

Yıl 1970 Cilt: 8 Sayı: 1

Kaynak Göster

APA
Büyük, U., Engin, S., Durmuş Acer, S., Aker, A., & Maraşlı, N. (2019). In-Bi-Cd ÖTEKTİK ALAŞIMININ MİKROYAPISAL DEĞERLENDİRİLMESİ VE MEKANİK DAVRANIŞI. Niğde Ömer Halisdemir Üniversitesi Mühendislik Bilimleri Dergisi, 8(1), 549-558. https://doi.org/10.28948/ngumuh.517188
AMA
1.Büyük U, Engin S, Durmuş Acer S, Aker A, Maraşlı N. In-Bi-Cd ÖTEKTİK ALAŞIMININ MİKROYAPISAL DEĞERLENDİRİLMESİ VE MEKANİK DAVRANIŞI. NÖHÜ Müh. Bilim. Derg. 2019;8(1):549-558. doi:10.28948/ngumuh.517188
Chicago
Büyük, Uğur, Sevda Engin, Semra Durmuş Acer, Aynur Aker, ve Necmetttin Maraşlı. 2019. “In-Bi-Cd ÖTEKTİK ALAŞIMININ MİKROYAPISAL DEĞERLENDİRİLMESİ VE MEKANİK DAVRANIŞI”. Niğde Ömer Halisdemir Üniversitesi Mühendislik Bilimleri Dergisi 8 (1): 549-58. https://doi.org/10.28948/ngumuh.517188.
EndNote
Büyük U, Engin S, Durmuş Acer S, Aker A, Maraşlı N (01 Ocak 2019) In-Bi-Cd ÖTEKTİK ALAŞIMININ MİKROYAPISAL DEĞERLENDİRİLMESİ VE MEKANİK DAVRANIŞI. Niğde Ömer Halisdemir Üniversitesi Mühendislik Bilimleri Dergisi 8 1 549–558.
IEEE
[1]U. Büyük, S. Engin, S. Durmuş Acer, A. Aker, ve N. Maraşlı, “In-Bi-Cd ÖTEKTİK ALAŞIMININ MİKROYAPISAL DEĞERLENDİRİLMESİ VE MEKANİK DAVRANIŞI”, NÖHÜ Müh. Bilim. Derg., c. 8, sy 1, ss. 549–558, Oca. 2019, doi: 10.28948/ngumuh.517188.
ISNAD
Büyük, Uğur - Engin, Sevda - Durmuş Acer, Semra - Aker, Aynur - Maraşlı, Necmetttin. “In-Bi-Cd ÖTEKTİK ALAŞIMININ MİKROYAPISAL DEĞERLENDİRİLMESİ VE MEKANİK DAVRANIŞI”. Niğde Ömer Halisdemir Üniversitesi Mühendislik Bilimleri Dergisi 8/1 (01 Ocak 2019): 549-558. https://doi.org/10.28948/ngumuh.517188.
JAMA
1.Büyük U, Engin S, Durmuş Acer S, Aker A, Maraşlı N. In-Bi-Cd ÖTEKTİK ALAŞIMININ MİKROYAPISAL DEĞERLENDİRİLMESİ VE MEKANİK DAVRANIŞI. NÖHÜ Müh. Bilim. Derg. 2019;8:549–558.
MLA
Büyük, Uğur, vd. “In-Bi-Cd ÖTEKTİK ALAŞIMININ MİKROYAPISAL DEĞERLENDİRİLMESİ VE MEKANİK DAVRANIŞI”. Niğde Ömer Halisdemir Üniversitesi Mühendislik Bilimleri Dergisi, c. 8, sy 1, Ocak 2019, ss. 549-58, doi:10.28948/ngumuh.517188.
Vancouver
1.Uğur Büyük, Sevda Engin, Semra Durmuş Acer, Aynur Aker, Necmetttin Maraşlı. In-Bi-Cd ÖTEKTİK ALAŞIMININ MİKROYAPISAL DEĞERLENDİRİLMESİ VE MEKANİK DAVRANIŞI. NÖHÜ Müh. Bilim. Derg. 01 Ocak 2019;8(1):549-58. doi:10.28948/ngumuh.517188